Precision Laser Cut Aluminum Nitride Ceramic Substrate

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
Material: Aluminum Nitride Ceramic
Manufacturer/Factory, Trading Company, Group Corporation

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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Precision Laser Cut Aluminum Nitride Ceramic Substrate
  • Precision Laser Cut Aluminum Nitride Ceramic Substrate
  • Precision Laser Cut Aluminum Nitride Ceramic Substrate
  • Precision Laser Cut Aluminum Nitride Ceramic Substrate
  • Precision Laser Cut Aluminum Nitride Ceramic Substrate
  • Precision Laser Cut Aluminum Nitride Ceramic Substrate
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  • Overview
  • Product Introduction
  • Manufacturing Capacity
  • Why Choose Us?
Overview

Basic Info.

Model NO.
JJBP-0141-0021
Forming Method
Tape Casting
Features
High Thermal Conductivity, Cte Matching Si
Usage
Bare Ceramic Circuit Board
Optional Color
Gray, Ivory
Density
Over 3.33G/Cm3
Standard Thickness
0.1-3mm Available
Thickness Tolerance
±0.03/0.05mm (Depending on Thickness)
Length and Width Tolerance
±2mm
Customized Service
OEM, ODM, Prototyping, Trial Order Supported
Type
Ceramic Plates
Transport Package
Individual Package
Specification
Max. up to 140mm× 190mm
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

Laser Cutting Any Graphics Bare AlN Aluminum Nitride Ceramic Substrate

Product Introduction

About Laser Cutting

Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.

Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.

With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.

As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
Precision Laser Cut Aluminum Nitride Ceramic Substrate

Manufacturing Capacity

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

AlN Ceramic Substrate
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As-fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
≥0.2   114.3 114.3   Tape Casting
0.38 140×190 140×190 120   Tape Casting
0.5 140×190 140×190 120   Tape Casting
0.635 140×190 200 200 Tape Casting
1 140×190 300 200 Tape Casting
1.5   300 200   Tape Casting
2   300 200   Tape Casting
2.5   300     Tape Casting
3   300     Tape Casting
  450     Isostatic Pressing
10   450     Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Laser Processing

(1) Hole Size

 
AlN Ceramic Substrate
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.2

(2) Laser Scribing
 
AlN Ceramic Substrate
Substrate Thickness (mm) the Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.5<T≤1.0 50%±3%
1.0<T≤1.2 55%±3%
1.2<T≤1.5 60%±3%
2.0 45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Why Choose Us?

Specializing in the production of bare ceramic substrates, Jinghui Industry Ltd. has 10+ years of R&D experience. Our products have high cost performance and will definitely satisfy you.

Precision Laser Cut Aluminum Nitride Ceramic Substrate

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