Customization: | Available |
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Application: | Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic |
Material: | Alumina Ceramic |
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How to Obtain Alumina Substrates of Different Colors
Alumina often needs to be colored in practical applications. We add colored ionic compounds to make alumina products in different colors.
- For example, in semiconductor integrated circuits, alumina used as a package shell should have light-shielding properties. Therefore, the Al2O3 on the back panel of the digital tube is also required to be black to ensure a clear digital display. For this purpose, Fe2O3, CoO.Cr2O3, TiO2, MnO and other colored oxides can be added into Al2O3.
- Another example, the pink alumina product is to add Cr2O3 into Al2O3 ceramics, because the Cr3+ ions in the solid solution α-Al2O3 lattice have a strong selective absorption of the blue-green color of visible light, showing a blue-green complementary color, that is, pink.
So far, the alumina substrate is the most commonly used substrate material in the electronics industry, because of its mechanical, thermal, and electrical properties compared to most other oxide ceramics. It has high strength and chemical stability, and is rich in raw materials. It is suitable for various technical manufacturing and can be produced in different shapes.
Since the first step in the preparation process of alumina PCB boards is to make bare alumina substrates. Below we will focus on our production capabilities on bare substrate products. After the bare alumina substrate is prepared, we can print circuits on it through DBC, DPC, TPC and other production processes and finally obtain an alumina PCB board. You are welcome to contact us for customization.
1. Product Specification
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
Bare Alumina Ceramic Substrate | |||||||
99.6% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
96% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.38 | 140×190 | √ | Tape Casting | ||||
0.5 | 140×190 | √ | Tape Casting | ||||
0.635 | 140×190 | √ | Tape Casting | ||||
0.76 | 130×140 | √ | Tape Casting | ||||
0.8 | 130×140 | √ | Tape Casting | ||||
0.89 | 130×140 | √ | Tape Casting | ||||
1 | 280×240 | √ | Tape Casting | ||||
1.5 | 165×210 | √ | Tape Casting | ||||
2 | 500×500 | √ | Tape Casting | ||||
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |
Bare Alumina Ceramic Substrate | ||||
Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
Length and Width Tolerance | / | ±2 | ±0.15 | |
Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
0.30-1.0 | ±0.05 | ±0.01 | ||
T>1.0 | ±10% | ±0.01 |
3. Material Properties
Bare Alumina Ceramic Substrate | ||||
Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
Mechanical Properties | ||||
Color | / | / | White | Ivory |
Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
Light Reflectivity | 400nm/1mm | % | 94 | 83 |
Flexural Strength | Three Point Bending | MPa | >350 | >500 |
Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
Young's Modulus | Stretching Method | GPa | 340 | 300 |
Water Absorption | % | 0 | 0 | |
Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
Thermal Properties | ||||
Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
Specific Heat | 25ºC | J/kg·k | 750 | 780 |
Electrical Properties | ||||
Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
Q1: Can the Size be Customized?
Yes, most of the alumina ceramic substrates are rectangular, square or round in shapes. Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm. We offer customized products for special requirements.
Q2: What is the Maximum ServiceTemperature of the Alumina Ceramic Substrates?
Alumina ceramic substrates can withstand high temperature of 1200-1400 ºC.
Q3: Can You Produce Alumina Ceramic Substrates in Different Colors?
Currently, we have been producing alumina ceramic substrates in optional colors such as white, ivory, pink, and black.
Q4: What is the Minimum Thickness of the Alumina Ceramic Substrates?
Our standard thickness: 0.25mm, 0.30mm, 0.38mm, 0.50mm, 0.635mm, 0.76mm, 0.80mm, 0.89mm, 1.0mm, 1.5mm and 2.0mm. Minimum thickness to be 0.1mm. Welcome to inquire about customized services.
Q5: Do the Bare Ceramic Substrates Meet the Requirements for Metallized Ceramic Circuit Boards?
Yes. Metallized ceramic substrates, also known as metallized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates and other fields in the electronic industry due to their advantages of thinness, high temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.
If your question is not listed here, please contact us for more information.