| Customization: | Available |
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| Application: | Refractory, Structure Ceramic, Industrial Ceramic, Brazing |
| Material: | Al2O3, Alumina Ceramic |
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DBC substrate is extensively used in a variety of Insulated gate bipolar diode (IGBT), laser devices (LD) and focused photovoltaic (CPV) and other high power devices package with heat dissipation application. Especially, alumina DBC ceramic substrates take a big part in the application because of its outstanding features:
(1) High thermal conductivity, meeting the heat dissipation requirements of the device;
(2) Good heat resistance, meeting the high temperature (greater than 200°C) ;
(3) Thermal expansion coefficient matching, matching with chip material thermal expansion coefficient, reducing package thermal stress;
(4) Low dielectric constant with high frequency feature, the signal transmission time of the device is reduced, also the signal transmission rate is improved;
(5) High mechanical strength, meeting the mechanical performance requirements in the process of device packaging
(6) Excellent corrosion resistance, able to withstand strong acid, strong alkali, boiling water, organic solution, etc.;
(7) The structure is compact, which meets the requirements of hermetic packaging of electronic devices;
We are able to deal with selection thickness of the ceramic substrate from 0.30mm to 1.0mm, also provide customized thickness of copper plating.
Besides, DBC process, we also supply TFC and TPC metallized ceramic substrate to meet different customers with special requirements.
Q1. Are you a factory or trading company?
A: We are a manufacturer with 15 years of OEM, ODM experience for technical ceramic components.
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