| Usage: | to Realize Electrical Connections |
|---|---|
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Surface Metallization Process: | Direct Plated Copper Technology |
| Feature: | Excellent Electrical and Thermal Properties |
| Transport Package: | Vacuum Packaging |
| Customization: |
|---|
){kind=link}