| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Circuit Board |
| Surface Metallization Process: | Silver Firing Process |
| Feature: | Excellent Electrical and Thermal Properties |
| Usage: | to Realize Electrical Connections |
| Customization: |
|---|
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Audited Supplier What Ceramic Materials are Generally Used for Ceramic Substrates?
In view of the advantages of ceramics such as good thermal conductivity, heat resistance, high insulation, high strength, low thermal expansion,
corrosion resistance and radiation resistance, ceramic substrates are widely used in power devices and high-temperature electronic device
packaging.
At present, ceramic substrate materials mainly include Al2O3, AlN, Si3N4, SiC, BeO and BN. Because Al2O3 and AlN have good comprehensive
properties, they occupy the mainstream in the low-end and high-end ceramic substrate markets respectively, while Si3N4 substrate is expected to
play an important role in the packaging of high-power, large-temperature-changing power electronic devices (such as IGBT) in the future due to its
high bending strength.
What is Metallization of Ceramic Substrates, and What are the Metallization Methods?
The metallized ceramic substrate is a ceramic plate obtained by metallizing the surface of the ceramic substrate by technical means. The ceramic
substrate has better electrical function, thermal conductivity and insulation after metallization.
Metallization methods on the surface of aluminum nitride (AlN) ceramic substrates include: Mo-Mn method, electroless nickel plating method, silver
firing method, and Direct Bonded Copper (DBC) method.
What is Silver Firing Method?
The silver firing method is to infiltrate a layer of metallic silver on the surface of the ceramic substrate. Silver has strong electrical conductivity and
good oxidation resistance. The fired silver layer is firmly bonded, the thermal expansion coefficient is close to that of the bare ceramic substrate, and
the thermal stability is good. In addition, the firing temperature is low, and the requirements on the atmosphere are not strict, and the firing process is
simple and easy.
Jinghui has more than 10 years of experience in R&D and production of metallized ceramic substrates, and has proofing and mass production
capabilities. We continuously promote the improvement and advancement of processes, facilities and equipment, actively seek new opportunities for
advanced material technologies, and assist customers in creating new operational value.
In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.
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