Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

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Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Material: Aluminum Nitride Ceramic
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Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management pictures & photos
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management pictures & photos
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management pictures & photos
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management pictures & photos
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management pictures & photos
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management pictures & photos
  • Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
  • Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
  • Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
  • Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
  • Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
  • Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

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Overview

Basic Info.

Model NO.
Customized
Forming Method
Tape Casting
Features
High Thermal Conductivity, Cte Matching Si
Usage
Blank Ceramic Circuit Board
Optional Color
Gray, Ivory
Density
Over 3.33G/Cm3
Thickness Tolerance
±0.03 (Standard) / ±0.01 (Best)
Length and Width Tolerance
±2mm
Transport Package
Individual Packaging
Specification
Standard Size: 50.8mm x 50.8mm, Or Customized
Trademark
JingHui
Origin
China
HS Code
6914100000
Production Capacity
50000 Pieces/Month

Packaging & Delivery

Package Size
27.00cm * 17.00cm * 20.00cm
Package Gross Weight
2.000kg

Product Description

Thin AlN Ceramic Plate Aluminum Nitride Substrate for Thermal Management

Product Features

Why Choose Ceramic Substrates?

Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
Why Choose the Aluminum Nitride Substrate?

The aluminum nitride substrate has excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, and is ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor module circuits and high-power devices.

Through the table below, you can see some performance comparisons between aluminum nitride (AlN) substrates and alumina (Al2O3) substrates.
 

Properties Unit AlN 96% Al2O3
Density g/cm³ ≥3.33 ≥3.70
Flexural Strength MPa ≥380 >350
Max. Service Temperature (Non-loading) ºC >1000 1200
CTE 20-800ºC, 10-6/ºC 4-6 7.8
Thermal Conductivity 20ºC, W/m·K 170-230 >24
Dielectric Strength KV/mm ≥17 ≥15
 

Manufacturing Capacity

Products of various specifications can be produced. The table below shows our standard sizes. The ultra-thin of 0.1mm to 0.2mm AIN Substrate will be achieved by lapping.

 
AlN Substrate
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As-fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
≥0.2   114.3 114.3   Tape Casting
0.38 140×190 140×190 120   Tape Casting
0.5 140×190 140×190 120   Tape Casting
0.635 140×190 200 200 Tape Casting
1 140×190 300 200 Tape Casting
1.5   300 200   Tape Casting
2   300 200   Tape Casting
2.5   300     Tape Casting
3   300     Tape Casting
  450     Isostatic Pressing
10   450     Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.
 

We also produce

Besides bare ceramic substrates, we also do metalized ceramic substrates. Metallized ceramics is one of our advantageous products.

 
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management
Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

Our Partners

Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

 

FAQ

Q1: What is the maximum service temperature of the aluminum nitride substrates?
Aluminum nitride substrates can withstand high temperatures over 1000 ºC.

Q2: What is the maximum thermal conductivity of your aluminum nitride substrates?
The thermal conductivity of aluminum nitride substrates is generally 170 W/(m·K) or higher. The maximum value can reach 230 W/(m·K), which is 8 times that of alumina. It has broad development prospects in fields like high-power electronic semiconductor modules, electronic heaters and semiconductor power hybrid circuits.

Q3: Do you provide free samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect a sample fee for MOQ.

Q4: How long is your delivery time?
If it is one of our standard sizes and we have it in stock, we will ship it within 2 days. In other cases, the standard delivery time is generally 4-6 weeks.

If your question is not listed here, please contact us for more information.

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