as Fired Mechanical Processing Available 96% Alumina Substrate Al2O3 Sheet

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
• Material: Al2O3
• Model NO.: JJBP-0111-0011
• Forming Method: Tape Casting
• Features: High Mechanical Strength, Small Dielectric Loss
• Usage: Blank Ceramic Circuit Board
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Standard Thickness: 0.25-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Trial Order Supported
• Type: Ceramic Plates
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

As Fired Mechanical Processing Available 96% Alumina Substrate Al2O3 Sheet

Product Introduction

Shape of the Alumina Ceramic Substrate

Our as fired bare alumina ceramic substrates are often rectangular or square in shapes.

Size of the Alumina Ceramic Substrate

The size of the alumina ceramic substrate is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the substrate to break during the PCB proofing process, resulting in a lot of waste.

Our standard thicknesses for as-fired 96% alumina ceramic substrates are 0.25mm, 0.30mm, 0.38mm, 0.50mm, 0.635mm, 0.76mm, 0.80mm, 0.89mm, 1.0mm, 1.5mm and 2.0mm.

Product Parameters

Alumina Ceramic Substrate
Item	Unit		96% Al2O3
Mechanical Properties
Color	/	/	White
Density	Drainage Method	g/cm^3	≥3.70
Light Reflectivity	400nm/1mm	%	94
Flexural Strength	Three Point Bending	MPa	>350
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0
Vickers Hardness	Load 4.9N	GPa	14
Young's Modulus	Stretching Method	GPa	340
Water Absorption		%	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8
Thermal Conductivity	25ºC	W/m·K	>24
Thermal Shock Resistance	800ºC	≥10 Times	No Crack
Specific Heat	25ºC	J/kg·k	750
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3
Volume Resistivity	25ºC	Ω·cm	≥10^14
Dielectric Strength	DC	KV/mm	≥15

Applications

Production Process

The molding process used for our alumina ceramic substrates is tape casting.

Product Inspection

Jinghui Industry Ltd. is dedicated to producing high quality products. We do our best to ensure that any substrates supplied by Jinghui Industry Ltd. fully meet your performance expectations.