| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Conductive Layer: | Thick Copper Layer |
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DBC ceramic substrates are widely used in the packaging and heat dissipation of Insulated Gate Bipolar Transistor (IGBT), Laser Diode (LD) and Concentrator Photovoltaics (CPV). JingHui strictly controls the eutectic temperature and oxygen content in the production of DBC ceramic substrates. Our technology is mature and you can trust it.
- Add oxygen between copper and ceramic substrate to obtain a Cu-O eutectic liquid with a temperature of 1065-1083°C.
- The intermediate phase (CuAlO2 or CuAl2O4) is obtained through the reaction to achieve chemical metallurgical bonding between the Cu layer and the ceramic substrate.
- Use photolithography technology to realize patterns and form circuits.
DBC ceramic substrate is a proven standard device in power electronic modules and has obvious advantages in IGBT and LD packaging fields. The copper foil of DBC ceramic substrate is generally thicker and has a strong current-carrying capacity, which can meet the application requirements of device packaging in extreme environments such as high temperature and high current. The process temperature of DBC ceramic substrate is high.
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