| Application: | Refractory, Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Parts |
| Usage: | Heat Dissipation PCB |
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Feature: | Excellent Electrical and Thermal Properties |
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier With the development of third-generation semiconductor (including GaN, SiC, AlN, etc.) technology, power devices have begun to develop rapidly in
the fields of semiconductor lighting, power electronics, microwave radio frequency, 5G communication and new energy vehicles, and the demand for
ceramic substrates has surged.
The silver firing method is to infiltrate a layer of metallic silver on the surface of the ceramic substrate. Silver has strong electrical conductivity and
good oxidation resistance. The fired silver layer is firmly bonded, the thermal expansion coefficient is close to that of the bare ceramic substrate, and
the thermal stability is good. In addition, the firing temperature is low, and the requirements on the atmosphere are not strict, and the firing process
is simple and easy.
The following is a schematic diagram of the Silver Firing Method of the ceramic substrate surface metallization process.
How about Our Product Quality?
Our products have been verified by the market for many years, their reliability and stability have been unanimously recognized by customers, and
their quality has reached the leading level in the market.
Jinghui has more than 10 years of experience in R&D and production of metallized ceramic substrates, and has proofing and mass production
capabilities. We continuously promote the improvement and advancement of processes, facilities and equipment, actively seek new opportunities for
advanced material technologies, and assist customers in creating new operational value.
Suppliers with verified business licenses
Audited Supplier 
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