| Customization: | Available |
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| Application: | Semiconductors, Electronics |
| Material: | 96% / 99.6% Alumina Ceramic |
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Electronic Ceramic Substrates Thermal Conductive Laser Cutting Scribing Insulation Sheets for Semiconductors
Alumina ceramic substrates have excellent electrical insulation properties, high thermal conductivity, high reliability, good high-frequency characteristics, and low thermal expansion coefficient. They have become the basic materials for high-power power electronic circuit structure technology and interconnection technology.
Due to the hard and brittle characteristics of ceramic materials themselves, their processing is very difficult. Traditional mechanical processing methods are time-consuming and labor-intensive, and there is stress during the processing, which can easily damage the substrate. Laser, as a flexible, efficient, and high-yield processing method, has become one of the most ideal means of processing ceramic substrates today.
Lasers are widely used in the scribing process of ceramic substrates after sintering. Scribing is to form lines by burning continuous and densely arranged dot-shaped pits on the surface of the ceramic by laser, so as to facilitate the packaging and division into independent small units.
| Alumina Ceramic Substrate | ||||
| Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
| Mechanical Properties | ||||
| Color | / | / | White | Ivory |
| Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
| Light Reflectivity | 400nm/1mm | % | 94 | 83 |
| Flexural Strength | Three Point Bending | MPa | >350 | >500 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
| Young's Modulus | Stretching Method | GPa | 340 | 300 |
| Water Absorption | % | 0 | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
| Thermal Properties | ||||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
| CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
| Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 | 780 |
| Electrical Properties | ||||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
1. Product Tolerances
| Alumina Ceramic Substrate | ||||
| Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
| Length and Width Tolerance | / | ±2 | ±0.15 | |
| Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
| 0.30-1.0 | ±0.05 | ±0.01 | ||
| T>1.0 | ±10% | ±0.01 | ||
| Alumina Ceramic Substrate | |||
| Material | Surface Roughness (μm) | ||
| As Fired | Lapped | Polished | |
| 96% Al2O3 | Ra 0.2-0.75 | Ra 0.3-0.7 | Ra ≤0.05 |
| 99.6% Al2O3 | Ra 0.05-0.15 | Ra 0.1-0.5 | Ra ≤0.05 |
Q1: Can the Size be Customized?
Yes, most of the alumina ceramic substrates are rectangular, square or round in shapes. Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm. We offer customized products for special requirements.
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