High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch

Product Details
Customization: Available
Application: Aerospace, Electronics, Medical, Machinery, Optoelectronics, Chemical Industry
Material: Al2O3
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
  • High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
  • High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
  • High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
  • High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
  • High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
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  • Overview
  • Product Introduction
  • Product Applications
  • Manufacturing Capacity
  • Production Process
  • Product Inspection
  • Product Recommendations
Overview

Basic Info.

Model NO.
Standard
Density
Over 3.70g/cm3
Forming Method
Tape Casting
Optional Color
White, Ivory, Pink, Black
Standard Thickness
0.25-2.0mm Available
Thickness Tolerance
0.03mm/0.05mm (Depending on Thickness)
Length and Width Tolerance
±2mm
Features
High Mechanical Strength, Small Dielectric Loss
Type
Ceramic Plate
Purity
96% / 99.6% Alumina
Transport Package
Cartons with EPE Foam
Specification
Max. up to 500mm x 500mm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000 Pieces/Month

Packaging & Delivery

Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg

Product Description

High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4x4 Inch

Product Introduction

Brief Introduction of Ceramic Substrates

Ceramic substrates are ideal packaging base materials for new generation integrated circuits and power electronic modules. Compared with plastic and metal substrates, ceramic substrates have the following advantages.

1. Good Insulation
Generally speaking, the higher the substrate resistance, the better the reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.

2. Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.

3. Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting points, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.

4. High Thermal Conductivity
Ceramic substrate materials are widely used in high-reliability, high-frequency, high-temperature resistance, and strong air-tight product packaging in aviation, aerospace, and military engineering. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuits (HIC) and multi-chip module (MCM) ceramic packages.


Material Properties

Alumina Ceramic Substrate
Item Unit 96% Al2O3 99.6% Al2O3
Mechanical Properties
Color / / White White
Density Drainage Method g/cm3 3.70 3.95
Light Reflectivity 400nm/1mm % 94 83
Flexural Strength Three Point Bending MPa >350 >500
Fracture Toughness Indentation Method MPa·m1/2 3.0 3.0
Vickers Hardness Load 4.9N GPa 14 16
Young's Modulus Stretching Method GPa 340 300
Water Absorption    % 0 0
Camber / Length‰ T≤0.3: ≤5‰, Others: ≤3‰ ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading) / ºC 1200 1400
CTE (Coefficient of
Thermal Expansion)
20-800ºC 1×10-6/ºC 7.8 7.9
Thermal Conductivity 25ºC W/m·K >24 >29
Thermal Shock Resistance 800ºC 10 Times No Crack No Crack
Specific Heat 25ºC J/kg·k 750 780
Electrical Properties
Dielectric Constant 25ºC, 1MHz / 9.4 9.8
Dielectric Loss Angle 25ºC, 1MHz ×10-4 ≤3 ≤2
Volume Resistivity 25ºC Ω·cm 1014 1014
Dielectric Strength DC KV/mm 15 15


 

Product Applications

1. 96% Alumina

96% alumina is the standard material for thick film circuit substrates. It has excellent electrical insulation properties, mechanical strength, good thermal conductivity, chemical durability and dimensional stability. Its surface roughness is generally 0.2-0.6um, and the max. operating temperature of the substrate can reach 1600°C.

High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch

Picture 1 - Alumina Thick Film Circuit Board



2. 99.6% Alumina

99.6% alumina is the mainly used material in most thin film circuit substrates. It has higher purity and smaller grain size. When made into a substrate, it has the advantage of excellent surface smoothness (surface roughness generally 0.08-0.1um), and the max. operating temperature of the substrate can reach 1700°C.


High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch

Picture 2 - Alumina Thin Film Circuit Board


 

Manufacturing Capacity

1. Product Specification

The table below shows our standard thicknesses and sizes. If you have customized needs, please contact us.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
0.25   114.3 114.3     Tape Casting
0.38 120 114.3 114.3     Tape Casting
0.5 120 114.3 114.3     Tape Casting
0.635 120 114.3 114.3     Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.25 120 114.3 114.3     Tape Casting
0.3 120 114.3 114.3     Tape Casting
0.38 140×190         Tape Casting
0.5 140×190         Tape Casting
0.635 140×190         Tape Casting
0.76 130×140         Tape Casting
0.8 130×140         Tape Casting
0.89 130×140         Tape Casting
1 280×240         Tape Casting
1.5 165×210         Tape Casting
2 500×500         Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.


2. Product Tolerances
 
Alumina Ceramic Substrate
Item Substrate Thickness (mm) Standard Tolerance (mm) Best Tolerance (mm) Laser Cutting Tolerance (mm)
Length and Width Tolerance / ±2   ±0.15
Thickness Tolerance T<0.3 ±0.03 ±0.01  
0.30-1.0 ±0.05 ±0.01  
T>1.0 ±10% ±0.01  


3. Surface Roughness
 
Alumina Ceramic Substrate
Material Surface Roughness (μm)
As Fired Lapped Polished
96% Al2O3 Ra 0.2-0.75 Ra 0.3-0.7 Ra ≤0.05
99.6% Al2O3 Ra 0.05-0.15 Ra 0.1-0.5 Ra ≤0.05


4. Laser Processing

(1) Hole Size

 
Alumina Ceramic Substrate
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.2

(2) Laser Scribing
 
Alumina Ceramic Substrate
Substrate Thickness (mm) Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.3<T≤0.5 50%±3%
0.5<T≤1.0 43%±3%
1.2 55%±3%
1.5 55%±3%
2.0 55%+10%
The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.


 

Production Process

High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
 

Product Inspection

High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
 

Product Recommendations

We offer bare ceramic substrates in various raw materials, sizes, shapes, and thicknesses. Welcome to communicate with us.

View More
 

High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch
High Electrical Insulation 96% Al2O3 Alumina Ceramic Substrate 4X4 Inch

 

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