Electronic 96% 99.6% Aluminium Oxide Sheet Thin Thick Film Circuit Al2O3 Plate High Alumina Ceramic Substrate for Semiconductor

• Application: Aerospace, Electronics, Medical, Machinery, Optoelectronics, Chemical Industry
• Grain Size: 1-10um
• Purity: 95%
• Type: Ceramic Plate
• Density: Over 3.70g/cm3
• Forming Method: Tape Casting
• Model NO.: JJBP-0111-0002
• Optional Color: White, Ivory, Pink, Black
• Standard Thickness: 0.25-2.0mm Available
• Thickness Tolerance: 0.03mm/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Features: High Mechanical Strength, Small Dielectric Loss
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Electronic 96% 99.6% Aluminium Oxide Sheet Thin Thick Film Circuit Al2O3 Plate High Alumina Ceramic Substrate for Semiconductor

Product Introduction

Brief Introduction of Ceramic Substrates

The ceramic substrate is a commonly used electronic packaging substrate material. Compared with plastic and metal substrates, ceramic substrate has the following advantages.

1. Good Insulation
Generally speaking, the higher the substrate resistance, the better the reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.

2. Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.

3. Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting points, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.

4. High Thermal Conductivity
Ceramic substrate materials are widely used in high-reliability, high-frequency, high-temperature resistance, and strong air-tight product packaging in aviation, aerospace, and military engineering. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuits (HIC) and multi-chip module (MCM) ceramic packages.


Material Properties

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	White
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

 

Manufacturing Capacity

1. Product Specification

The table below shows our standard thicknesses and sizes. If you have customized needs, please .

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.5	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

2. Product Tolerances
 

Alumina Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<0.3	±0.03	±0.01
	0.30-1.0	±0.05	±0.01
	T>1.0	±10%	±0.01

3. Surface Roughness
 

Alumina Ceramic Substrate
Material	Surface Roughness (μm)
	As Fired	Lapped	Polished
96% Al2O3	Ra 0.2-0.75	Ra 0.3-0.7	Ra ≤0.05
99.6% Al2O3	Ra 0.05-0.15	Ra 0.1-0.5	Ra ≤0.05

4. Laser Processing

(1) Hole Size
 

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

Production Process

 

Product Inspection

 

Product Recommendations

We offer bare ceramic substrates in various raw materials, sizes, shapes, and thicknesses. Welcome to communicate with us.