Custom Electronic Industrial 96% 99.6% Aluminum Oxide Thin Thick Film Circuit Al2O3 High Alumina Ceramic Substrate for Semiconductor

Product Description

Custom Electronic Industrial 96% 99.6% Aluminium Oxide Thin Thick Film Circuit Al2O3 High Alumina Ceramic Substrate for Semiconductor

Manufacturing Capacity

1. Product Specification

The table below shows our standard sizes. If you need customization, please .

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.5	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

2. Product Tolerances

Alumina Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<0.3	±0.03	±0.01
	0.30-1.0	±0.05	±0.01
	T>1.0	±10%	±0.01

3. Surface Roughness

Alumina Ceramic Substrate
Material	Surface Roughness (μm)
	As Fired	Lapped	Polished
96% Al2O3	Ra 0.2-0.75	Ra 0.3-0.7	Ra ≤0.05
99.6% Al2O3	Ra 0.05-0.15	Ra 0.1-0.5	Ra ≤0.05

4. Laser Processing

(1) Hole Size

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing

Alumina Ceramic Substrate
Substrate Thickness (mm)	Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

Product Features

Ceramic substrates are ideal packaging base materials for new generation integrated circuits and power electronic modules. Compared with plastic and metal substrates, ceramic substrates have the following advantages.

1. Good Insulation
Generally speaking, the higher the substrate resistance, the better the reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.

2. Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.

3. Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting points, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.

4. High Thermal Conductivity
Ceramic substrate materials are widely used in aviation, aerospace, and other engineering projects for high-reliability, high-frequency, high-temperature-resistant, and highly airtight product packaging. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuits (HIC) and multi-chip module (MCM) ceramic packages.

Material Properties

 

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	White
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

 

Product Applications

1. 96% Alumina

96% alumina is the standard material for thick film circuit substrates. It has excellent electrical insulation properties, mechanical strength, good thermal conductivity, chemical durability, and dimensional stability. Its surface roughness is generally 0.2-0.6 μm, and the maximum operating temperature of the substrate can reach 1600°C.

 

2. 99.6% Alumina

99.6% alumina is the primary material used in most thin-film circuit substrates. It has higher purity and smaller grain size. When made into a substrate, it has the advantage of excellent surface smoothness (surface roughness generally 0.08- 0.1um), and the max. The operating temperature of the substrate can reach 1700°C.

Production Process

Product Inspection

Product Recommendations

We offer bare ceramic substrates in various raw materials, sizes, shapes, and thicknesses. Welcome to communicate with us.