Big Size Ceramic Base PCB Al2O3 Alumina Aluminum Oxide Substrate

• Dielectric: Alumina Ceramic
• Forming Method: Tape Casting
• Features: High Mechanical Strength, Small Dielectric Loss
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: JJBP-0111-0019
• Usage: Bare Ceramic Circuit Board
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Trial Order Supported
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Package Size: 36.00cm * 20.00cm * 24.00cm
• Package Gross Weight: 8.000kg

Product Description

Big Size Ceramic Base PCB Al2O3 Alumina Aluminum Oxide Substrate

 

Advantages of Ceramic Substrates Over Traditional PCB Boards

1. The ceramic substrate's heat dissipation and insulation performance are better.
(1) The thermal conductivity of the ceramic substrate is between 25-230W/m.K: the most commonly used are Al2O3 substrate: 25-30W/m·K, Si3N4 substrate: 80-95W/m·K, and AIN substrate: 150-230W/m·K. The traditional PCB board is made of glass fiber material, and the thermal conductivity is lower than 1.1W/m·K, far inferior to ceramic substrates.

Material	Thermal Conductivity (W/m·K)
FR4	0.8-1.1
Alumina (Al2O3)	25-30
Silicon Nitride (Si3N4)	80-95
Aluminum Nitride (AIN)	170-230

(2) The volume resistivity of the ceramic substrate is more than 10¹⁴Ω·cm, and the insulation performance far exceeds that of the traditional PCB board.

2. The CTE of the ceramic substrate is matched to that of the semiconductor silicon material, which helps minimize the stress that can cause components and solder joints to crack.

3. The ceramic substrate has high reliability and stable performance in extreme environments (such as high temperature, high humidity, high pressure, high corrosion, high radiation, high-frequency vibration, etc.), while the traditional PCB board cannot adapt to harsh environments, e.g. the glass transition temperature of the traditional PCB board is generally 170°C, and it will soften or deform if it exceeds this temperature.

About the Size

The size of the alumina ceramic substrate is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the substrate to break during the PCB proofing process, resulting in a lot of waste.

Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm.

Manufacturing Capacity

1. Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.5	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500				√		Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

 

2. Material Properties

 

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

Production Process

The molding process used for our alumina ceramic substrates is tape casting. 


Product Packaging

Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.