| Customization: | Available |
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| Application: | Aerospace, Electronics, Medical |
| Material: | Alumina Ceramic |
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1. Forming Method
There are mainly Dry Pressing, Hot Pressing, Isostatic Pressing, and Ceramic Injection Molding (CIM), each of which has its own advantages and disadvantages. We will choose the most suitable forming method on the basis of saving costs and ensuring quality.
2. Finishing Process
In order to achieve the precision of the product, most ceramic structural parts need further finishing treatment after the sintering process. The main finishing processes we use are machining (lapping, polishing...) and glazing.
3. Metallization Process
Metallization of ceramics refers to the creation of thin metal layers (films) on the surface of ceramics. After the surface of the ceramic material is metallized, it has both the characteristics of ceramics and the properties of metal.
Introduction to Mo-Mn Method
The Mo-Mn method is to coat metal powders such as Mo powder and Mn powder on the ceramic surface, and then sinter at high temperature in a reducing atmosphere (hydrogen gas), thereby forming a metal layer on the ceramic surface. Because Mo and ceramics have similar thermal expansion coefficients, the thermal stress after bonding is small, so the bonding strength between the metal film and ceramics is high.
The brief process of Mo-Mn method is shown in the picture below.
We can produce metallized ceramic structural parts of various specifications according to customers' drawings.
Product Applications
| Category | Property | Unit | 99.8% Al2O3 |
99.5% Al2O3 |
99% Al2O3 |
95% Al2O3 |
94.4% Al2O3 |
| Mechanical | Density | g/cm3 | ≥3.95 | ≥3.90 | ≥3.85 | ≥3.65 | ≥3.60 |
| Water absorption | % | 0 | 0 | 0 | 0 | 0 | |
| Vickers hardness | HV | 1700 | 1700 | 1700 | 1500 | 1500 | |
| Flexural strength | Mpa | ≥ 390 | ≥ 379 | ≥ 338 | ≥ 320 | ≥ 312 | |
| Compressive strength | Mpa | ≥ 2650 | ≥ 2240 | ≥ 2240 | ≥ 2000 | ≥ 2000 | |
| Fracture toughness | Mpam1/2 | 4-5 | 4-5 | 4-5 | 3-4 | 3-4 | |
| Thermal | Max. Service temperature (non-loading) |
ºC | 1750 | 1675 | 1600 | 1500 | 1500 |
| CTE (Coefficient of thermal expansion) 20-800ºC |
1×10-6/ºC | 6.5-8.2 | 6.5-8.0 | 6.2-8.0 | 5.0-8.0 | 5.0-8.0 | |
| Thermal shock | T (ºC) | ≥ 200 | ≥ 200 | ≥ 200 | ≥ 220 | ≥ 220 | |
| Thermal conductivity 25ºC |
W/(m·k) | 31 | 30 | 29 | 24 | 22.4 | |
| Specific heat | 1×103J/(kg·k) | 0.78 | 0.78 | 0.78 | 0.78 | 0.78 | |
| Electrical | Volume resistivity 25ºC |
ohm·cm | > 1×1014 | > 1×1014 | > 1×1014 | > 1×1014 | > 1×1014 |
| 300ºC | 1×1012 | 1×1012 | 8×1011 | 1012-1013 | 1012-1013 | ||
| 500ºC | 2×1012 | 5×1010 | 2×109 | 1×109 | 1×109 | ||
| Dielectric strength | KV/mm | 20 | 19 | 18 | 18 | 18 | |
| Dielectric constant (1Mhz) | (E) | 9.8 | 9.7 | 9.5 | 9.5 | 9.5 |
We are confident that we can fulfill your product requirements well. Welcome to order with drawings or samples, and look forward to becoming your reliable partner!
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