Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Structure Ceramic, Industrial Ceramic
Material: Aluminum Nitride (Aln) Ceramic
Manufacturer/Factory, Trading Company, Group Corporation

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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
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  • Overview
  • Product Introduction
  • Production Process
  • Our Advantages
  • Product Inspection
Overview

Basic Info.

Model NO.
Customized
Finished Product
Ceramic Circuit Board
Surface Metallization Process
Electroless Nickel Plating Process
Feature
Strong Bonding Strength Between Ceramic and Metal
Usage
to Realize Electrical Connections
Type
Ceramic Plates
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
Product Introduction

With the continuous development of power device technology,

especially with the rise of the third-generation semiconductor

technology, the application fields and demand of ceramic substrates

continue to expand due to their good thermal conductivity, heat

resistance, high strength and high reliability.


Application of Ceramic Circuit Boards

1. LED field

2. High power semiconductor module

3. Semiconductor cooler

4. Electric heater

5. Power control circuit

6. Power hybrid circuit

7. Smart power components

8. High frequency switching power supply

9. Solid state relay

10. Automotive electronics

11. Aerospace and military electronic components

12. Solar panel modules
 
Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
What is Metallization of Ceramic Substrates?

Ceramic substrate metallization is to firmly adhere a layer of metal film

on the surface of ceramic substrate to realize the welding between

ceramic and metal. There are many ceramic substrate metallization

processes such as Mo-Mn method, electroless nickel plating method,

silver firing method, and Direct Bonded Copper (DBC) method.

 

Production Process

Electroless nickel plating technology is a deposition process in which metals are produced through controllable redox reactions under the catalysis of

metals. Compared with electroplating nickel, electroless nickel plating has the characteristics of uniform coating, small pinholes, no need for DC

power supply equipment
, deposition on non-conductors
and some special properties.


In addition, due to less waste discharge, less environmental pollution and lower cost, electroless nickel plating technology has gradually replaced

electroplating nickel in many fields and has become an environmentally friendly surface treatment process.


The following is the general process of the electroless nickel plating method applied to the surface of the ceramic substrate.

Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate
Our Advantages

Jinghui has advanced metallized ceramic substrate production equipment and technology, and can meet customers' R&D process and production

needs with fast delivery and stable quality, giving priority to quality and helping customers seize market opportunities.

Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate

Product Inspection

In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.

Electroless Nickel Plating Technology Ni Plated Aluminum Nitride Ceramic Substrate

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