Laser Scribing Ceramic PCB Alumina Substrates

• Application: Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
• Type: Ceramic Plates
• Forming Methods: Tape Casting
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: JJBP-0111-0008
• Purity of Material: 96%, 99.6% Alumina
• Optional Color: White, Ivory, Pink, Black
• Min. Thickness: 0.1mm
• Max. Thickness: 2.0mm
• Features: High Mechanical Strength, Small Dielectric Loss
• Usage: Blank Ceramic Circuit Board
• Material: Alumina Ceramic
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Package Size: 36.00cm * 20.00cm * 24.00cm
• Package Gross Weight: 8.000kg

Product Description

Laser Processing Ceramic Substrate PCB Board Multiple Sizes Alumina Substrates

Manufacturing Capacity

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Below is the standard dimensions of our bare alumina substrates.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.5	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

For products that require high dimensional accuracy, we can use various processing methods to process ceramic substrates, such as lapping, polishing, laser scribing, laser cutting, etc.

 Laser Processing

(1) Hole Size

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Applications

The alumina ceramic substrate has the following advantages:

1. High Wear & Chemical Resistance	2. Heat Resistant	3. High Mechanical Strength
4. Small Dielectric Loss	5. Good Thermal Conductivity	6. High Light Reflection
7. 0% Water Absorption

The picture below shows the typical application scenarios of alumina ceramic substrates.

Product Parameters

For material properties, please refer to the table below.

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

Product Recommendations

Beside bare ceramic substrates, we also manufacture metallized ceramic PCBs. Metallized ceramics is one of our advantageous products.

FAQ

Q1: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect sample fee for MOQ.

Q2: How Long is the Production Lead Time?

If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.

Q3: What is the Depth of the Laser Scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-65% of the substrate thickness. The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Q4: How are Ceramic Substrates Packaged to Avoid Breakage?
Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.

Q5: Can Alumina Ceramic Substrates be Polished?
Yes, lapping and polishing will provide the desired flatness and thickness tolerance, with a surface roughness generally below Ra0.05.

If your question is not listed here, please contact us for more information.