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| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | AlN |
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Aluminum nitride (AlN) is an advanced ceramic material for high-power hybrid semiconductor packaging where high thermal conductivity is required. AlN substrates have a thermal conductivity of more than 170W/m·K.
Molding Technique of the Aluminum Nitride Substrate
Although dry pressing and isostatic pressing are suitable for producing high-performance aluminum nitride substrates, they are high in cost and low production efficiency, and cannot meet the increasing demand for aluminum nitride ceramic substrates in the electronics industry. To solve this problem, in recent years, many manufacturers have adopted tape-casting technique to produce aluminum nitride substrates. Tape casting has also become the main molding technique for aluminum nitride substrates used in the electronics industry.
The aluminum nitride substrate has high hardness and high brittleness, making it difficult to process. Most of the aluminum nitride substrates are rectangular, square, or round in shape. Our rectangular shapes for as-fired aluminum nitride substrates are available up to 140mm×190mm. Below is our standard dimensions of AlN substrates.
| AlN Substrate | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As-fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| ≥0.2 | 114.3 | 114.3 | √ | √ | Tape Casting | ||
| 0.38 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.5 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.635 | 140×190 | 200 | 200 | √ | √ | √ | Tape Casting |
| 1 | 140×190 | 300 | 200 | √ | √ | √ | Tape Casting |
| 1.5 | 300 | 200 | √ | √ | Tape Casting | ||
| 2 | 300 | 200 | √ | √ | Tape Casting | ||
| 2.5 | 300 | √ | √ | Tape Casting | |||
| 3 | 300 | √ | √ | Tape Casting | |||
| … | 450 | √ | √ | Isostatic Pressing | |||
| 10 | 450 | √ | √ | Isostatic Pressing | |||
| Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. | |||||||
For material properties, please refer to the table below.
| AlN Substrate | ||
| Item | Unit | Value |
| Mechanical Properties | ||
| Color | / | Gray |
| Density | g/cm³ | ≥3.33 |
| Flexural Strength | MPa | ≥380 |
| Water Absorption | % | 0 |
| Camber | Length‰ | ≤3‰ |
| Thermal Properties | ||
| Max. Service Temperature (Non-loading) | ºC | >1000 |
| CTE (Coefficient of Thermal Expansion) |
20-800ºC, 1×10-6/ºC | 4-6 |
| Thermal Conductivity | 20ºC, W/m·K | 170-230 |
| Electrical Properties | ||
| Dielectric Constant | 1MHz | 8-10 |
| Volume Resistivity | 20ºC, Ω·cm | ≥1013 |
| Dielectric Strength | KV/mm | ≥17 |
Q1: What is the maximum service temperature of the aluminum nitride substrates?
Aluminum nitride substrates can withstand high temperatures over 1000 ºC.
Q2: What is the maximum thermal conductivity of your aluminum nitride substrates?
The thermal conductivity of aluminum nitride substrates is generally 170 W/(m·K) or higher. The maximum value can reach 230 W/(m·K), which is 8 times that of alumina. It has broad development prospects in fields like high-power electronic semiconductor modules, electronic heaters and semiconductor power hybrid circuits.
Q3: Do you provide free samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect a sample fee for MOQ.
Q4: How long is your delivery time?
If it is one of our standard sizes and we have it in stock, we will ship it within 2 days. In other cases, the standard delivery time is generally 4-6 weeks.
If your question is not listed here, please contact us for more information.
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