Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB

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Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Material: AlN
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  • Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
  • Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
  • Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
  • Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
  • Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
  • Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
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  • Overview
  • Product Features
  • Manufacturing Capacity
  • We also produce
  • Our Partners
Overview

Basic Info.

Model NO.
Customized
Forming Method
Tape Casting
Feature
High Thermal Conductivity, Cte Matching Si
Usage
Blank Ceramic Circuit Board
Optional Color
Gray, Ivory
Density
Over 3.33G/Cm3
Thickness Tolerance
±0.03 (Standard) / ±0.01 (Best)
Length and Width Tolerance
±2mm
Customized Service
OEM, ODM, Prototyping, Mass Production
Transport Package
Individual Packaging
Specification
Standard or Customized
Trademark
Jinghui
Origin
China
HS Code
6914100000
Production Capacity
50000 Pieces/Month

Packaging & Delivery

Package Size
27.00cm * 17.00cm * 20.00cm
Package Gross Weight
2.000kg

Product Description

Heat Dissipation Aluminum Nitride Substrate AlN Ceramic Plate for PCB

Product Features

Why choose ceramic substrates?

Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
Why choose the AlN ceramic plate?

The AlN ceramic plate has excellent thermal conductivity, reliable electrical insulation, low dielectric constant, and dielectric loss, and is ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor modules circuits, and high-power devices.

Through the table below, you can see some performance comparisons between aluminum nitride (AlN) ceramic plates and 96% alumina (Al2O3) ceramic plates.
 

Properties Unit AlN 96% Al2O3
Density g/cm³ ≥3.33 ≥3.70
Flexural Strength MPa ≥380 >350
Max. Service Temperature (Non-loading) ºC >1000 1200
CTE 20-800ºC, 10-6/ºC 4-6 7.8
Thermal Conductivity 20ºC, W/m·K 170-230 >24
Dielectric Strength KV/mm ≥17 ≥15

Manufacturing Capacity

We can make various specifications. The table below shows our standard sizes. The ultra-thin of 0.1mm to 0.2mm AIN ceramic plate will be achieved by lapping.

 
AlN Ceramic Plate
Thickness (mm) Maximum Size (mm) Shape Forming Process
As-fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
≥0.2   114.3 114.3   Tape Casting
0.38 140×190 140×190 120   Tape Casting
0.5 140×190 140×190 120   Tape Casting
0.635 140×190 200 200 Tape Casting
1 140×190 300 200 Tape Casting
1.5   300 200   Tape Casting
2   300 200   Tape Casting
2.5   300     Tape Casting
3   300     Tape Casting
  450     Isostatic Pressing
10   450     Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

We also produce

Besides bare ceramic substrates, we also make metallized ceramic substrates. You are welcome to contact us for a quote.

 
Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB
Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB

Our Partners

Heat Dissipation Aluminum Nitride Substrate Aln Ceramic Plate for PCB

 

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