• Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
  • Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
  • Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
  • Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
  • Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
  • Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics

Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics

Application: Refractory, Electronics, Structure Ceramic, Industrial Ceramic, Wear Resistance
Type: Ceramic Plates
Product Name: Alumina Substrate
Forming Methods: Tape Casting, ISO Pressed, Dry Pressed
Optional Color: White, Ivory, Pink
Purity of Material: 96%, 99%, 99.5%, 99.8%
Samples:
US$ 10/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Diamond Member Since 2020

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Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
  • Overview
  • Product Description
  • The specification
  • The Prime Characteristics
  • Typical Applications
  • We also produce
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
Customized
Density
Over 3.65g/cm3
MOQ
10PCS Per Order
Thickness
From 0.15mm to 30mm Available
Normial Tolerance
Thickness to Be 0.05mm
Precision Tolerance
Thickness to Be 0.01mm
Flatness
Best to Be 0.005mm Via Fine Grinding
Features
High Dielectrical, High Insulation
Material
Alumina Ceramic
Transport Package
Individual Packaging
Specification
600mm x 500mm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
5000000/Month

Product Description

Laser Cutting 96% Al2o3 Ceramic Alumina Substrate for Electronics
 
Product Description

Alumina is a most popular technical ceramic for making ceramic substrate for electronics because the advantages of high resistivity,outstanding thermal conductivity, good mechanical and dielectric strength, also chemical stability.

The main shaping method is tape casting, it's easy to obtain dense ceramic body with high-efficient productivity. In common case, 96% alumina ceramic substrate is for thick-flim technology, and above 99.5% alumina ceramic substrate is for thin-flim circuit which require a more rigorous quality for the grain size, the surface finish of ceramic substrates. Currently, we  have been making both electronic substrates for ages.

The specification
99.6% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
  As Fired Lapped Polished Rectangular Square Round  
0.1-0.2   50.8 50.8   Tape Casting
0.25   114.3 114.3     Tape Casting
0.38 120 114.3 114.3     Tape Casting
0.50 120 114.3 114.3     Tape Casting
0.635 120 114.3 114.3     Tape Casting
Remark: Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
  As Fired Lapped Polished Rectangular Square Round  
0.25 120 114.3 114.3     Tape Casting
0.30 120 114.3 114.3     Tape Casting
0.38 140×190         Tape Casting
0.50 140×190         Tape Casting
0.635 140×190         Tape Casting
0.76 130×140         Tape Casting
0.80 130×140         Tape Casting
0.89 130×140         Tape Casting
1 280×240         Tape Casting
1.50 165×210         Tape Casting
2 500×500         Tape Casting
Remark: Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.
The Prime Characteristics
Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
1. High thermal conductivity, up to 31 W/m.k at 25ºC      
        
2. Quality surface with ideal flatness, warpage and roughness

3. High dielectric strength, low dielectric constant, and dielectric loss.

4. High hardness and exceptional flexural & fracture strength

5. Corrosion resistance and fit for various of harsh enviroments

6. Anti-oxidization and not rust for ever in very humid conditions
                      
7. Easy to achieve different pattern by laser cutting with precision tolerance.
Typical Applications

Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics

We also produce
Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics
Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics

 

Packaging & Shipping

1.  In order to ensure our customers to receive their substrate in a good conditions,  the internal configuration of packaging will be designed customized.


2. Standard packaging solution, refer to the following diagram:
Laser Cutting 96% Al2O3 Ceramic Alumina Substrate for Electronics

FAQ

Q01: What sizes are available for the Alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.

 

Q02.What are the main advantages of a Ceramic PCB?

A: Maximum operating temperatures of the substrates of over 800°C, high Thermal Conductivity of up to 180W/mK, very low CTE (Coefficient of Thermal Expansion), 0% water absorption for Hermetic packages, low signal loss and fine microcircuit applications with the DPC production method.

Q3: What is the via diameter available for Alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

Q4:How are the ceramic substrates machined?
A: We use 100% laser processes. This is the best way to ensure precise and clean milling and drilling of the ceramic.

Q5: What other products do you manufacture?
A: Yes, we also produce metalized ceramics, ceramic seals and high precision pump plunger and pistons besides alumina ceramic substrates.

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Diamond Member Since 2020

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
Registered Capital
1000000 RMB
Plant Area
>2000 square meters