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| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | Al2O3 |
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Alumina is a most popular technical ceramic for making ceramic substrate for electronics because the advantages of high resistivity,outstanding thermal conductivity, good mechanical and dielectric strength, also chemical stability.
The main shaping method is tape casting, it's easy to obtain dense ceramic body with high-efficient productivity. In common case, 96% alumina substrate is for thick-flim technology, and above 99.6% alumina substrate is for thin-flim circuit which require a more rigorous quality for the grain size, the surface finish of ceramic substrates. Currently, we have been making both electronic substrates for ages.
| 99.6% Al2O3 | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Forming Method | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| 0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
| 0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.50 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| Remark: Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
| 96% Al2O3 | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Forming Method | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.30 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.38 | 140×190 | √ | Tape Casting | ||||
| 0.50 | 140×190 | √ | Tape Casting | ||||
| 0.635 | 140×190 | √ | Tape Casting | ||||
| 0.76 | 130×140 | √ | Tape Casting | ||||
| 0.80 | 130×140 | √ | Tape Casting | ||||
| 0.89 | 130×140 | √ | Tape Casting | ||||
| 1 | 280×240 | √ | Tape Casting | ||||
| 1.50 | 165×210 | √ | Tape Casting | ||||
| 2 | 500×500 | √ | Tape Casting | ||||
| Remark: Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. | |||||||
1. In order to ensure our customers to receive their substrate in a good conditions, the internal configuration of packaging will be designed customized.
2. Standard packaging solution, refer to the following diagram:
Q1: What sizes are available for alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.
Q2: What are the main advantages of ceramic substrates?
A: Maximum operating temperature of the ceramic substrate is over 800°C; high thermal conductivity of up to 180W/mK; very low CTE (Coefficient of Thermal Expansion); 0% water absorption for hermetic packages; low signal loss and fine microcircuit applications.
Q3: What is the available via diameter for alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.
Q4: How are ceramic substrates machined?
A: We use laser technology 100%. This is the best way to ensure precise and clean milling and drilling of the ceramic.
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