Not Metallized Ultra Thin ZrO2 Plate Zirconia Ceramic Substrate PCB
Introduction of Zirconia Ceramic Substrates
Zirconia ceramics have high toughness, high flexural strength, high wear resistance, excellent thermal insulation properties and the thermal expansion coefficient close to that of steel. Zirconia ceramic substrates have obvious advantages, such as
strong mechanical properties,
high temperature resistance,
corrosion resistance,
low thermal conductivity, and
high insulation. There are irreplaceable applications.
At present, injection molding, dry pressing and tape casting are usually used to pruduce zirconia ceramic substrates.
1. Injection molding is only suitable for forming thick substrates with thicknesses more than 1mm.
2. Dry pressing often causes delamination of the green body due to uneven radial and axial pressure distribution during the molding process.
3. Tape casting is suitable for producing thin ceramic substrates with thicknesses from 0.2mm to 3mm. The have the advantages of fast production speed, high degree of automation, uniform structure and good product quality.
Below is the process flow of our bare ceramic substrates.
Do the Bare Ceramic Substrates Meet the Requirements for Metallized Ceramic Circuit Boards?
Yes. Metallized ceramic substrates, also known as metallized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates and other fields in the electronic industry due to their advantages of thinness, high temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.
Material Properties of Zirconia Ceramic Substrates
| Zirconia Ceramic Substrate |
| Item |
Unit |
ZrO2 |
| Mechanical Properties |
| Color |
/ |
White |
| Density |
g/cm3 |
≥6 |
| Water Absorption |
% |
0 |
| Vickers Hardness (Load 4.9N) |
Gpa |
11 |
| Young's Modulus |
GPa |
200 |
| Flexural Strength |
Mpa |
>800 |
| Fracture Toughness |
MPa·m1/2 |
5.0 |
| Thermal Properties |
| Max. Service Temperature (Non-loading) |
ºC |
1000 |
| CTE (Coefficient of Thermal Expansion) (20-800ºC) |
1×10-6/ºC |
7.8 |
| Thermal Shock Resistance |
≥10 Times |
No Crack |
| Thermal Conductivity (25ºC) |
W/m·K |
>3 |
| Specific Heat (25ºC) |
J/kg·K |
460 |
| Electrical Properties |
| Volume Resistivity (25ºC) |
Ω·cm |
≥1013 |
| Dielectric Strength |
KV/mm |
≥10 |
| Dielectric Constant (25ºC, 1MHz ) |
(E) |
33 |
| Dielectric Loss Angle (25ºC, 1MHz ) |
×10-4 |
≤16 |
Why Choose Us?
1. Custom sizes & thicknesses are available upon request.
2. Various processings are available (surface lapping & polishing, laser scribing & cutting, metallization, etc.).
3. Sufficient manufacturing capacity and advanced detection equipments.
4. With sufficient stock for all standard sizes, and with flexible delivery.
5. Stable quality, consistent product specifications for each batch.
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