| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Surface Metallization Process: | Mo-Mn Metallization and Ni Plating |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Customization: |
|---|
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Why Metallization is Necessary on the Surface of Ceramic Substrates?
We need to realize electrical connections through the ceramic substrate. Therefore, the surface of the ceramic substrate needs to be metallized, and
then the surface pattern is completed by the method of image transfer.
Metallization is a crucial part of the production of ceramic substrates, because the wetting ability of metals on ceramic surfaces at high temperatures
determines the bonding force between metals and ceramics, which is an important guarantee for the stability of packaging performance.
Therefore, how to implement metallization on the surface of ceramic substrates and improve the bonding force between the two has become the
focus of research by many scientists.
What is Mo-Mn Method?
The simple mechanism of molybdenum-manganese (Mo-Mn) ceramic metallization is:
Mo powder and Mn powder are used as the main raw materials, and the Mo layer is sintered at high temperature in a reducing atmosphere. Since
the Mo layer is not easily wetted by solder, it is also necessary to plate a layer of nickel on the metallized Mo layer.
Jinghui has advanced metallized ceramic substrate production equipment and technology, and can meet customers' R&D process and production
needs with fast delivery and stable quality, giving priority to quality and helping customers seize market opportunities.
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