500mm * 500mm Large Size Al2O3 PCB Sheet Alumina Ceramic Substrate

• Application: Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
• Material: Alumina Ceramic
• Type: Ceramic Plates
• Forming Method: Tape Casting
• Purity of Material: 96% Alumina
• Features: High Mechanical Strength, Small Dielectric Loss
• Model NO.: JJBP-0111-0019
• Usage: Blank Ceramic Circuit Board
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Length and Width Tolerance: ±2mm
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

500mm * 500mm Large Size Al2O3 PCB Sheet Alumina Ceramic Substrate

Product Introduction

About the Size

The size of the alumina ceramic substrate is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the substrate to break during the PCB proofing process, resulting in a lot of waste.

Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm.

Why Choose Ceramic Substrates?

Product Parameters

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

Production Process

The molding process used for our alumina ceramic substrates is tape casting. 

Packaging & Shipping

Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.