96% Al2O3 Circuit Board Alumina PCB Thick Film Ceramic Substrates
Ceramic substrates have outstanding thermal and dielectric properties. These are essential to today's semiconductors industry. Typical ceramic substrates are generally made out of alumina or aluminum nitride.
Alumina ceramic is the most common substrate material you'll find in today's printed circuit boards. It boasts an
excellent balance of thermal and electrical conductivity when compared to other oxide ceramic substrates.
The alumina ceramic substrate is also reputed for
better mechanical strength and
chemical stability and is
readily available. These properties make it the ideal option for technical manufacturing, especially when various shapes have to be considered.
1. Product Specification
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
| 96% Alumina Ceramic Substrate |
| Thickness (mm) |
Maximum Size (mm) |
Shape |
Molding Technique |
| As Fired |
Lapped |
Polished |
Rectangular |
Square |
Round |
| 0.25 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.3 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.38 |
140×190 |
|
|
√ |
|
|
Tape Casting |
| 0.5 |
140×190 |
|
|
√ |
|
|
Tape Casting |
| 0.635 |
140×190 |
|
|
√ |
|
|
Tape Casting |
| 0.76 |
130×140 |
|
|
√ |
|
|
Tape Casting |
| 0.8 |
130×140 |
|
|
√ |
|
|
Tape Casting |
| 0.89 |
130×140 |
|
|
√ |
|
|
Tape Casting |
| 1 |
280×240 |
|
|
√ |
|
|
Tape Casting |
| 1.5 |
165×210 |
|
|
√ |
|
|
Tape Casting |
| 2 |
500×500 |
|
|
√ |
|
|
Tape Casting |
| Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |
2. Product Tolerances
| 96% Alumina Ceramic Substrate |
| Item |
Substrate Thickness (mm) |
Standard Tolerance (mm) |
Best Tolerance (mm) |
Laser Cutting Tolerance (mm) |
| Length and Width Tolerance |
/ |
±2 |
|
±0.15 |
| Thickness Tolerance |
T<0.3 |
±0.03 |
±0.01 |
|
| 0.30-1.0 |
±0.05 |
±0.01 |
|
| T>1.0 |
±10% |
±0.01 |
|
3. Surface Roughness
| 96% Alumina Ceramic Substrate |
| Surface Roughness (μm) |
| As Fired |
Lapped |
Polished |
| Ra 0.2-0.75 |
Ra 0.3-0.7 |
Ra ≤0.05 |
4. Laser Processing
(1) Hole Size
| 96% Alumina Ceramic Substrate |
| Hole Diameter (mm) |
Standard Tolerance (mm) |
| φ≤0.5 |
0.08 |
| φ>0.5 |
0.2 |
(2) Laser scribing
| 96% Alumina Ceramic Substrate |
| Substrate Thickness (mm) |
the Percentage of
Laser Scribe Line Depth
to Thickness (%) |
| 0.2-0.3 |
40%±5% |
| 0.3<T≤0.5 |
50%±3% |
| 0.5<T≤1.0 |
43%±3% |
| 1.2 |
55%±3% |
| 1.5 |
55%±3% |
| 2.0 |
55%+10% |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. |
| 96% Alumina Ceramic Substrate |
| Item |
Unit |
96% Al2O3 |
| Mechanical Properties |
| Color |
/ |
/ |
White |
| Density |
Drainage Method |
g/cm3 |
≥3.70 |
| Light Reflectivity |
400nm/1mm |
% |
94 |
| Flexural Strength |
Three Point Bending |
MPa |
>350 |
| Fracture Toughness |
Indentation Method |
MPa·m1/2 |
3.0 |
| Vickers Hardness |
Load 4.9N |
GPa |
14 |
| Young's Modulus |
Stretching Method |
GPa |
340 |
| Water Absorption |
|
% |
0 |
| Camber |
/ |
Length‰ |
T≤0.3: ≤5‰, Others: ≤3‰ |
| Thermal Properties |
| Max. Service Temperature (Non-loading) |
/ |
ºC |
1200 |
CTE (Coefficient of
Thermal Expansion) |
20-800ºC |
1×10-6/ºC |
7.8 |
| Thermal Conductivity |
25ºC |
W/m·K |
>24 |
| Thermal Shock Resistance |
800ºC |
≥10 Times |
No Crack |
| Specific Heat |
25ºC |
J/kg·k |
750 |
| Electrical Properties |
| Dielectric Constant |
25ºC, 1MHz |
/ |
9.4 |
| Dielectric Loss Angle |
25ºC, 1MHz |
×10-4 |
≤3 |
| Volume Resistivity |
25ºC |
Ω·cm |
≥1014 |
| Dielectric Strength |
DC |
KV/mm |
≥15 |
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