96% Al2O3 Circuit Board Alumina PCB Thick Film Ceramic Substrates

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors
• Forming Method: Tape Casting
• Model NO.: JJBP-0111-0003
• Material: 96% Alumina
• Features: High Mechanical Strength, Small Dielectric Loss
• Usage: Blank Ceramic Circuit Board
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Standard Thickness: 0.1-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

96% Al2O3 Circuit Board Alumina PCB Thick Film Ceramic Substrates
 

Product Description

Ceramic substrates have outstanding thermal and dielectric properties. These are essential to today's semiconductors industry. Typical ceramic substrates are generally made out of alumina or aluminum nitride.

Alumina ceramic is the most common substrate material you'll find in today's printed circuit boards. It boasts an excellent balance of thermal and electrical conductivity when compared to other oxide ceramic substrates.

The alumina ceramic substrate is also reputed for better mechanical strength and chemical stability and is readily available. These properties make it the ideal option for technical manufacturing, especially when various shapes have to be considered.
 

The specification

1. Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

96% Alumina Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

2. Product Tolerances
 

96% Alumina Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<0.3	±0.03	±0.01
	0.30-1.0	±0.05	±0.01
	T>1.0	±10%	±0.01

3. Surface Roughness
 

96% Alumina Ceramic Substrate
Surface Roughness (μm)
As Fired	Lapped	Polished
Ra 0.2-0.75	Ra 0.3-0.7	Ra ≤0.05

4. Laser Processing

(1) Hole Size
 

96% Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser scribing
 

96% Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

Product Parameters

 

96% Alumina Ceramic Substrate
Item	Unit		96% Al2O3
Mechanical Properties
Color	/	/	White
Density	Drainage Method	g/cm^3	≥3.70
Light Reflectivity	400nm/1mm	%	94
Flexural Strength	Three Point Bending	MPa	>350
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0
Vickers Hardness	Load 4.9N	GPa	14
Young's Modulus	Stretching Method	GPa	340
Water Absorption		%	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8
Thermal Conductivity	25ºC	W/m·K	>24
Thermal Shock Resistance	800ºC	≥10 Times	No Crack
Specific Heat	25ºC	J/kg·k	750
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3
Volume Resistivity	25ºC	Ω·cm	≥10^14
Dielectric Strength	DC	KV/mm	≥15