High Bonding Strength Alumina Circuit Board Aluminum Nitride Aln Metallized Ceramic Substrate

• Application: Structure Ceramic, Industrial Ceramic
• Type: Ceramic Plates
• Finished Product: Ceramic Circuit Board
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: JHDT-01
• Substrate Material: 96%, 99.6% Alumina or Aln
• Usage: to Realize Electrical Connections
• Feature: Strong Bonding Strength Between Ceramic and Metal
• Transport Package: Vacuum Packaging
• Specification: According to the Drawing
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Production Capacity: 50000pieces/Month
• Package Size: 36.00cm * 20.00cm * 24.00cm
• Package Gross Weight: 8.000kg

Product Description

High Bonding Strength Alumina Circuit Board Aluminum Nitride AlN Metallized Ceramic Substrate

Product Introduction

Jinghui Ceramic has advanced surface treatment process of ceramic substrates and has mass production capacity. Our products have been verified by the market for 15 years. The quality is reliable and stable. Welcome to consult us.


Why Metallization is Necessary on the Surface of Ceramic Substrates

We need to realize electrical connections through the ceramic substrate. Therefore, the surface of the ceramic substrate needs to be metallized, and then the surface pattern is completed by the method of image transfer.

Metallization is a crucial part of the production of ceramic substrates, because the wetting ability of metals on ceramic surfaces at high temperatures determines the bonding force between metals and ceramics, which is an important guarantee for the stability of packaging performance.

Therefore, how to implement metallization on the surface of ceramic substrates and improve the bonding force between the two has become the focus of research by many scientists.
 

Which Metallization Processes We Support?

Jinghui Ceramic can process precision circuits, especially good at Mo-Mn metallization, electroless nickel plating method, silver metallization, and DBC technology. You can consult us for more processing methods.


1. Mo-Mn Metallization



2. Electroless Nickel Plating Method


3. Silver Metallization


4. Direct Bonded Copper (DBC) Technology

 

Product Applications

Where are Ceramic Circuit Boards Mainly Used?
 

1. LED field

2. High power semiconductor module

3. Semiconductor cooler

4. Electric heater

5. Power control circuit

6. Power hybrid circuit

7. Smart power components

8. High frequency switching power supply

9. Solid state relay

10. Automotive electronics

11. Aerospace and military electronic components

12. Solar panel modules

Product Inspection

In order to ensure product quality, we implement strict inspection in every production link.