• Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications

Metallized Ceramic Substrates for RF Radio Frequency Applications

Application: Refractory, Structure Ceramic, Industrial Ceramic, Brazing
Material: Alumina Ceramic
Type: Ceramic Parts
Product Name: Ceramic Substrates for RF Application
Optional Purity: 96%, 99% and 99.5% Alumina
Color: White, Beige, Pink
Samples:
US$ 20/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Diamond Member Since 2020

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
  • Overview
  • Product Description
  • Manufacturing flow chart
  • We also produce
  • Why choose us?
Overview

Basic Info.

Model NO.
Customized
Surface Treatment
Polished, Glazed
Norminal
1% of Dimensions
Usage
for Ceramic to Metal Joint Technology
Transport Package
Vacuum Packaging with Desciant
Specification
36cm x 20cm x 24cm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000/Month

Product Description

Metallized Ceramic Substrates for RF Radio Frequency Applications
Product Description

Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film processing. Differentfrom the traditional thick film and thin film processing technology, its processing strengthens the requirements of electrochemical processing. After the metallization of the ceramic surface is achieved by physical methods, the conductive copper and functional film layers are processed electrochemically.

Manufacturing flow chart


Metallized Ceramic Substrates for RF Radio Frequency Applications

We also produce
Metallized Ceramic Substrates for RF Radio Frequency Applications
Metallized Ceramic Substrates for RF Radio Frequency Applications
Metallized Ceramic Substrates for RF Radio Frequency Applications
Why choose us?

Under the trend of intelligence, the application of DPC technology will be more common to meet the needs of miniaturization and high precision.

Jinghui's mature DPC technology can customize the thickness of metal circuits for you to meet your diverse needs.

Metallized Ceramic Substrates for RF Radio Frequency Applications

 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

You Might Also Like

Diamond Member Since 2020

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
Registered Capital
1000000 RMB
Plant Area
>2000 square meters