Metallized Ceramic Substrates for RF Radio Frequency Applications

Product Details
Customization: Available
Application: Refractory, Structure Ceramic, Industrial Ceramic, Brazing
Material: Alumina Ceramic
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
  • Metallized Ceramic Substrates for RF Radio Frequency Applications
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  • Overview
  • Product Description
  • Manufacturing flow chart
  • We also produce
  • Why choose us?
Overview

Basic Info.

Model NO.
Customized
Product Name
Ceramic Substrates for RF Application
Optional Purity
96%, 99% and 99.5% Alumina
Color
White, Beige, Pink
Surface Treatment
Polished, Glazed
Norminal
1% of Dimensions
Usage
for Ceramic to Metal Joint Technology
Type
Ceramic Parts
Transport Package
Vacuum Packaging with Desciant
Specification
36cm x 20cm x 24cm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000/Month

Product Description

Metallized Ceramic Substrates for RF Radio Frequency Applications
Product Description

Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film processing. Differentfrom the traditional thick film and thin film processing technology, its processing strengthens the requirements of electrochemical processing. After the metallization of the ceramic surface is achieved by physical methods, the conductive copper and functional film layers are processed electrochemically.

Manufacturing flow chart


Metallized Ceramic Substrates for RF Radio Frequency Applications

We also produce
Metallized Ceramic Substrates for RF Radio Frequency Applications
Metallized Ceramic Substrates for RF Radio Frequency Applications
Metallized Ceramic Substrates for RF Radio Frequency Applications
Why choose us?

Under the trend of intelligence, the application of DPC technology will be more common to meet the needs of miniaturization and high precision.

Jinghui's mature DPC technology can customize the thickness of metal circuits for you to meet your diverse needs.

Metallized Ceramic Substrates for RF Radio Frequency Applications

 

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