Industrial High Purity 99.6% Al2O3 Substrate Alumina Ceramic Sheet
The Prime Characteristics
1. High Wear & Chemical Resistance
2. Heat Resistant
3. High Mechanical Strength
4. Small Dielectric Loss
5. Low Coefficient of Thermal Expansion (CTE)
6. High Light Reflection
7. 0% Water Absorption
The ceramic substrate material is widely used in electronic packaging substrate for its advantages such as high strength, good insulation, good thermal conductivity and heat resistance, small thermal expansion coefficient (CTE), and good chemical stability.
Alumina ceramics are in a dominant position in the fields of microelectronics, power electronics, hybrid microelectronics, and power modules due to their superior comprehensive performance, and are widely used.
| 99.6% Alumina Ceramic Substrate |
| Item |
Unit |
99.6% Al2O3 |
| Mechanical Properties |
| Color |
/ |
/ |
Ivory |
| Density |
Drainage Method |
g/cm3 |
≥3.95 |
| Light Reflectivity |
400nm/1mm |
% |
83 |
| Flexural Strength |
Three Point Bending |
MPa |
>500 |
| Fracture Toughness |
Indentation Method |
MPa·m1/2 |
3.0 |
| Vickers Hardness |
Load 4.9N |
GPa |
16 |
| Young's Modulus |
Stretching Method |
GPa |
300 |
| Water Absorption |
|
% |
0 |
| Camber |
/ |
Length‰ |
≤3‰ |
| Thermal Properties |
| Max. Service Temperature (Non-loading) |
/ |
ºC |
1400 |
CTE (Coefficient of
Thermal Expansion) |
20-800ºC |
1×10-6/ºC |
7.9 |
| Thermal Conductivity |
25ºC |
W/m·K |
>29 |
| Thermal Shock Resistance |
800ºC |
≥10 Times |
No Crack |
| Specific Heat |
25ºC |
J/kg·k |
780 |
| Electrical Properties |
| Dielectric Constant |
25ºC, 1MHz |
/ |
9.8 |
| Dielectric Loss Angle |
25ºC, 1MHz |
×10-4 |
≤2 |
| Volume Resistivity |
25ºC |
Ω·cm |
≥1014 |
| Dielectric Strength |
DC |
KV/mm |
≥15 |
1. Product Specification
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
| 99.6% Alumina Ceramic Substrate |
| Thickness (mm) |
Maximum Size (mm) |
Shape |
Molding Technique |
| As Fired |
Lapped |
Polished |
Rectangular |
Square |
Round |
| 0.1-0.2 |
|
50.8 |
50.8 |
|
√ |
√ |
Tape Casting |
| 0.25 |
|
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.38 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.5 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.635 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. |
2. Product Tolerances
| 99.6% Alumina Ceramic Substrate |
| Item |
Substrate Thickness (mm) |
Standard Tolerance (mm) |
Best Tolerance (mm) |
Laser Cutting Tolerance (mm) |
| Length and Width Tolerance |
/ |
±2 |
|
±0.15 |
| Thickness Tolerance |
T<0.3 |
±0.03 |
±0.01 |
|
| 0.30-1.0 |
±0.05 |
±0.01 |
|
| T>1.0 |
±10% |
±0.01 |
|
3. Surface Roughness
| 99.6% Alumina Ceramic Substrate |
| Surface Roughness (μm) |
| As Fired |
Lapped |
Polished |
| Ra 0.05-0.15 |
Ra 0.1-0.5 |
Ra ≤0.05 |
4. Laser Processing
(1) Hole Size
| 99.6% Alumina Ceramic Substrate |
| Hole Diameter (mm) |
Standard Tolerance (mm) |
| φ≤0.5 |
0.08 |
| φ>0.5 |
0.2 |
(2) Laser Scribing
| 99.6% Alumina Ceramic Substrate |
| Substrate Thickness (mm) |
the Percentage of
Laser Scribe Line Depth
to Thickness (%) |
| 0.2-0.3 |
40%±5% |
| 0.3<T≤0.5 |
50%±3% |
| 0.5<T≤1.0 |
43%±3% |
| 1.2 |
55%±3% |
| 1.5 |
55%±3% |
| 2.0 |
55%+10% |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. |
Specializing in the production of bare ceramic substrates, Jinghui Industry Ltd. has 15+ years of R&D experience. Our products have high-cost performance and will definitely satisfy you.
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