0.1mm 0.2mm Ultra-thin 99.6% Aluminum Oxide Sheet Al2O3 Alumina Ceramic Wafer
1. Thickness
The thicker the alumina ceramic wafer, the better the strength and the stronger the pressure resistance, but the thermal conductivity is worse than that of the thinner one. On the contrary, the thinner the wafer, the weaker the strength and pressure resistance than the thicker one, but the thermal conductivity is stronger.
2. Shape
Most of the alumina ceramic wafers are single-sided or double-sided. The shape of the wafer is generally rectangular, square, or round.
3. Size
The size of the alumina ceramic wafer is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the wafer to break during the PCB proofing process, resulting in a lot of waste.
4. Forming Method
Common ceramic wafer forming methods mainly include dry pressing, isostatic pressing, and tape casting.
Dry pressing has high density and good wafer flatness, but low production efficiency and high cost, making it difficult to prepare ultra-thin wafers.
Isostatic pressing has a uniform distribution of compact density and low firing shrinkage, but it is difficult to precisely control the size and shape, and the productivity is low.
Tape casting is easy to operate, efficient in production, capable of continuous operation, and has a high level of automation. The density of the embryo body and the elasticity of the diaphragm are large. The processing technology is mature. The production specifications are controllable and products of various specifications can be produced. For these reasons, tape casting is widely used in the production of alumina ceramic wafers.
1. Product Specification of 99.6% Alumina Ceramic Substrates
We can make various specifications. The table below shows our standard sizes.
| 99.6% Alumina Ceramic Wafer |
| Thickness (mm) |
Maximum Size (mm) |
Shape |
Molding Technique |
| As Fired |
Lapped |
Polished |
Rectangular |
Square |
Round |
| 0.1-0.2 |
|
50.8 |
50.8 |
|
√ |
√ |
Tape Casting |
| 0.25 |
|
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.38 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.5 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| 0.635 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
| Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. |
2. Product Tolerances
| 99.6% Alumina Ceramic Wafer |
| Item |
Substrate Thickness (mm) |
Standard Tolerance (mm) |
Best Tolerance (mm) |
Laser Cutting Tolerance (mm) |
| Length and Width Tolerance |
/ |
±2 |
|
±0.15 |
| Thickness Tolerance |
T<0.3 |
±0.03 |
±0.01 |
|
| 0.30-1.0 |
±0.05 |
±0.01 |
|
| T>1.0 |
±10% |
±0.01 |
|
1. We provide personalized customization services. Machining services for products includes lapping, polishing, laser scribing, laser cutting, etc.
Surface Roughness
| 99.6% Alumina Ceramic Wafer |
| Surface Roughness (μm) |
| As Fired |
Lapped |
Polished |
| Ra 0.05-0.15 |
Ra 0.1-0.5 |
Ra ≤0.05 |
Laser Processing: Hole Size
| 99.6% Alumina Ceramic Wafer |
| Hole Diameter (mm) |
Standard Tolerance (mm) |
| φ≤0.5 |
0.08 |
| φ>0.5 |
0.2 |
2. In order to meet different market requirements, we put our unceasing efforts into promoting
quality control. Please contact us for further information.
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