Mirror Polished Aluminum Nitride Substrate High Smoothness Aln Ceramic Plate

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors
• Material: AlN
• Model NO.: JJBP-0141-0014
• Forming Method: Tape Casting
• Features: High Thermal Conductivity, Cte Matching Si
• Density: Over 3.33G/Cm3
• Standard Thickness: 0.1-3mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Mass Production
• Transport Package: Individual Packaging
• Specification: Customized
• Trademark: Jinghui
• Origin: China
• HS Code: 6914100000
• Production Capacity: 50000 Pieces/Month
• Package Size: 27.00cm * 17.00cm * 20.00cm
• Package Gross Weight: 2.000kg

Product Description

Mirror Polished Aluminum Nitride Substrate High Smoothness AlN Ceramic Plate

Product Introduction

Mirror polished aluminum nitride (AlN) ceramic plate is a high-performance electronic material with unique physical and chemical properties and is widely used in high-power and high-frequency electronic devices.
 

Characteristics of AlN Ceramic Plates

1. High thermal conductivity

2. Low coefficient of thermal expansion (CTE)

3. Excellent electrical insulation

4. High mechanical strength and hardness

5. Chemical stability

6. Laser processing compatibility

Applications

Product Parameters

AlN Ceramic Plate
Item	Unit	Value
Mechanical Properties
Color	/	Gray
Density	g/cm³	≥3.33
Flexural Strength	MPa	≥380
Water Absorption	%	0
Camber	Length‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	ºC	>1000
CTE (Coefficient of Thermal Expansion)	20-800ºC, 1×10^-6/ºC	4-6
Thermal Conductivity	20ºC, W/m·K	170-230
Electrical Properties
Dielectric Constant	1MHz	8-10
Volume Resistivity	20ºC, Ω·cm	≥10^13
Dielectric Strength	KV/mm	≥17

Manufacturing Capacity

1. Product Specification

We can make various specifications. The table below shows our standard sizes.
 

AlN Ceramic Plate
Thickness (mm)	Maximum Size (mm)			Shape			Forming Process
	As-fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

2. Product Tolerances
 

AlN Ceramic Plate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<1.0	±0.03	±0.01
	1.0≤T<1.5	±0.05	±0.01
	T≥1.5	±0.07	±0.01

3. Surface Roughness
 

AlN Ceramic Plate
Material	Surface Roughness (μm)
	As Fired	Lapped	Polished
AIN	Ra 0.4	Ra 0.3-0.7	Ra ≤0.05

4. Laser Processing

(1) Hole Size
 

AlN Ceramic Plate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

AlN Ceramic Plate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.5<T≤1.0	50%±3%
1.0<T≤1.2	55%±3%
1.2<T≤1.5	60%±3%
2.0	45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Packaging & Shipping

Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.