Application: | Structure Ceramic, Industrial Ceramic |
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Type: | Ceramic Plates |
Finished Product: | Ceramic Circuit Board |
Substrate Material: | 96%, 99.6% Alumina or Aln |
Feature: | Strong Bonding Strength Between Ceramic and Metal |
Usage: | to Realize Electrical Connections |
Customization: |
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Suppliers with verified business licenses
Good Electrical Function Al2O3 / AlN Ceramic Substrate with Metallization
Jinghui specializes in the production of metallized ceramic substrates, has rich experience in manufacturing ceramic circuit boards, and is proficient
in the surface treatment process of ceramic substrates such as Mo-Mn method (high-melting-point metal method), electroless nickel plating, silver
firing and Direct Bonded Copper (DBC).
1. Mo-Mn Method
2. Electroless Nickel Plating Method
3. Silver Firing Method
4. Direct Bonded Copper (DBC) Method
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