Good Electrical Function Al2O3 / Aln Ceramic Substrate with Metallization

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Structure Ceramic, Industrial Ceramic
• Material: Al2O3
• Model NO.: Customized
• Finished Product: Ceramic Circuit Board
• Substrate Material: 96%, 99.6% Alumina or Aln
• Feature: Strong Bonding Strength Between Ceramic and Metal
• Usage: to Realize Electrical Connections
• Type: Ceramic Plates
• Transport Package: Vacuum Packaging
• Specification: According to the Drawing
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Good Electrical Function Al2O3 / AlN Ceramic Substrate with Metallization

Product Introduction

As the development of microelectronic products tends to diversify

functions, high performance and product miniaturization, especially the

developmentof 5G communication technology requires communication

equipment (network base stations, large filters) to have higher power,

ceramic substrates are characterized by their low thermal

resistance,high voltage resistance, high heat dissipation, long life

and other excellent characteristics, it has a very broad application

prospect in the fields of high-power LED industry, high-frequency

electronic equipment, large-scale network base stations, filter devices,

etc.

The metallization of the surface of the ceramic substrate is an

important prerequisite for determining its practical application,

because themetal is the component that is connected to the working

circuit, and the effective combination of the two improves the

performance of electronic products.

Our Advantages

Jinghui specializes in the production of metallized ceramic substrates, has rich experience in manufacturing ceramic circuit boards, and is proficient

in the surface treatment process of ceramic substrates such as Mo-Mn method (high-melting-point metal method), electroless nickel plating, silver

firing and Direct Bonded Copper (DBC).
 

1. Mo-Mn Method



2. Electroless Nickel Plating Method


3. Silver Firing Method


4. Direct Bonded Copper (DBC) Method

Product Inspection