Autocatalytic Nickel Plating Electroless Ni Plated Alumina Ceramic Substrate PCB

• Dielectric: Alumina Ceramic
• Finished Product: Ceramic Circuit Board
• Substrate Material: 96%, 99.6% Alumina
• Surface Metallization Process: Electroless Nickel Plating Process
• Feature: Excellent Electrical and Thermal Properties
• Usage: to Realize Electrical Connections
• Model NO.: Customized
• Transport Package: Vacuum Packaging
• Specification: According to the Drawing
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Autocatalytic Nickel Plating Electroless Ni Plated Alumina Ceramic Substrate PCB

Product Introduction

Why Metallization is Necessary on the Surface of Ceramic

Substrates?


The ceramic substrate has better electrical function, thermal

conductivity and insulation after metallization.


What are the Methods of Metallization of Ceramic Substrates?


Ceramic substrate metallization is to firmly adhere a layer of metal film

on the surface of ceramic substrate to realize the welding between

ceramic and metal. There are many ceramic substrate metallization

processes such as Mo-Mn method, electroless nickel plating method,

silver firing method, and Direct Bonded Copper (DBC) method.
 

What is Electroless Nickel Plating Method?


The process flow of electroless nickel plating is shown in the picture

on the left.

1. Surface treatment: to purify and roughen the surface of the

ceramic substrate;

2. Sensitization: the process of evenly adsorbing a layer of SnCl2 on

the surface of the ceramic substrate;

3. Activation: immerse the sensitized ceramic substrate in the

activation solution to deposit a layer of Pd on its surface (forming a

catalyst layer that induces nickel deposition reaction);

4. Pre-plating: the process of soaking the ceramic substrate in the

pre-plating solution to form a thin and uniform metal nickel film on the

surface of the ceramic substrate, and cleaning off the excess

activation solution;

5. Final plating: form a uniform Ni-P alloy layer with a certain

thickness on the surface of the ceramic substrate;

6. Heat treatment: make the Ni-P alloy layer dense, increase the

degree of crystallization, and increase the bonding strength with the

substrate.
 

 

Product Applications

Where are Ceramic Circuit Boards Mainly Used?


Ceramic substrates have very broad application prospects in high-power LED industry, high-frequency electronic equipment, large-scale network

base stations, filter devices and other fields.

 

Why Choose Us?

Jinghui is a professional manufacturer of metallized ceramic substrates. It is our goal to provide ideal solutions for customers' different application

requirements. Whether it is cost or engineering solutions, our goal is to find the most economical and suitable solution for our customers!