High Flexural Strength Precision Polishing Zro2 Wafer Zirconia Ceramic Substrate

• Customization: Available
• Application: Refractory, Structure Ceramic, Industrial Ceramic
• Material: Alumina Ceramic
• Model NO.: JJBP-0121-0016
• Forming Method: Tape Casting
• Features: High Flexural Strength and Wear Resistance
• Usage: Blank Ceramic Circuit Board
• Optional Color: White, Yellow, Black, Blue
• Density: Over 6.0g/cm3
• Dielectric Constant: 33MHz
• Dielectric Loss Angle: ≦16MHz
• Customized Service: OEM, ODM, Prototyping, Trial Order Supported
• Type: Ceramic Substrate, Ceramic Plates
• Flexural Strength: >800MPa
• Transport Package: Individual Package
• Specification: Standard or Customized
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

High Flexural Strength Precision Polishing ZrO2 Wafer Zirconia Ceramic Substrate

Introduction of Zirconia Ceramic Substrates

In terms of functional ceramics, zirconia ceramic substrates are used as induction heating tubes, refractory materials, and heating elements due to their excellent high temperature resistance.

Zirconia ceramics have sensitive electrical parameters, high toughness, high flexural strength and high wear resistance, excellent heat insulation performance, and the thermal expansion coefficient close to that of steel. They are mainly used in oxygen sensors, thermal substrates for fuel cells, solid oxide fuel cells and high temperature heating elements and other fields.
 

Why Polished?

Three major benefits of lapping and polishing for the ceramic substrate:

1. A finer pattern can be obtained.

2. Better parallelism of the upper and lower surfaces (thickness tolerance) can be achieved.

3. A thinner metallization layer can be acquired.

Material Properties of Zirconia Ceramic Substrates
 

Zirconia Ceramic Substrate
Item	Unit	ZrO2
Mechanical Properties
Color	/	White
Density	g/cm^3	≥6
Water Absorption	%	0
Vickers Hardness (Load 4.9N)	Gpa	11
Young's Modulus	GPa	200
Flexural Strength	Mpa	>800
Fracture Toughness	MPa·m^1/2	5.0
Thermal Properties
Max. Service Temperature (Non-loading)	ºC	1000
CTE (Coefficient of Thermal Expansion) (20-800ºC)	1×10^-6/ºC	7.8
Thermal Shock Resistance	≥10 Times	No Crack
Thermal Conductivity (25ºC)	W/m·K	>3
Specific Heat (25ºC)	J/kg·K	460
Electrical Properties
Volume Resistivity (25ºC)	Ω·cm	≥10^13
Dielectric Strength	KV/mm	≥10
Dielectric Constant (25ºC, 1MHz )	(E)	33
Dielectric Loss Angle (25ºC, 1MHz )	×10^-4	≤16

Production Process of Zirconia Ceramic Substrates


Product Inspection