High Flexural Strength Precision Polishing ZrO2 Wafer Zirconia Ceramic Substrate
Introduction of Zirconia Ceramic Substrates
In terms of functional ceramics, zirconia ceramic substrates are used as induction heating tubes, refractory materials, and heating elements due to their excellent high temperature resistance.
Zirconia ceramics have sensitive
electrical parameters, high
toughness, high
flexural strength and high
wear resistance, excellent
heat insulation performance, and the
thermal expansion coefficient close to that of steel. They are mainly used in oxygen sensors, thermal substrates for fuel cells, solid oxide fuel cells and high temperature heating elements and other fields.
Why Polished?
Three major benefits of lapping and polishing for the ceramic substrate:
1. A finer pattern can be obtained.
2. Better parallelism of the upper and lower surfaces (thickness tolerance) can be achieved.
3. A thinner metallization layer can be acquired.
Material Properties of Zirconia Ceramic Substrates
Zirconia Ceramic Substrate |
Item |
Unit |
ZrO2 |
Mechanical Properties |
Color |
/ |
White |
Density |
g/cm3 |
≥6 |
Water Absorption |
% |
0 |
Vickers Hardness (Load 4.9N) |
Gpa |
11 |
Young's Modulus |
GPa |
200 |
Flexural Strength |
Mpa |
>800 |
Fracture Toughness |
MPa·m1/2 |
5.0 |
Thermal Properties |
Max. Service Temperature (Non-loading) |
ºC |
1000 |
CTE (Coefficient of Thermal Expansion) (20-800ºC) |
1×10-6/ºC |
7.8 |
Thermal Shock Resistance |
≥10 Times |
No Crack |
Thermal Conductivity (25ºC) |
W/m·K |
>3 |
Specific Heat (25ºC) |
J/kg·K |
460 |
Electrical Properties |
Volume Resistivity (25ºC) |
Ω·cm |
≥1013 |
Dielectric Strength |
KV/mm |
≥10 |
Dielectric Constant (25ºC, 1MHz ) |
(E) |
33 |
Dielectric Loss Angle (25ºC, 1MHz ) |
×10-4 |
≤16 |
Production Process of Zirconia Ceramic Substrates
Product Inspection