0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate

Product Details
Customization: Available
Application: Refractory, Structure Ceramic, Industrial Ceramic
Material: Alumina Ceramic
Manufacturer/Factory, Trading Company, Group Corporation

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Plant Area
20000 square meters
  • 0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate
  • 0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate
  • 0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate
  • 0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate
  • 0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate
  • 0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate
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  • Overview
  • Product Introduction
  • Manufacturing Capacity
  • Product Parameters
  • Applications
  • FAQ
Overview

Basic Info.

Model NO.
JJBP-0141-0013
Usage
Bare Ceramic Circuit Board
Forming Method
Tape Casting
Features
High Thermal Conductivity, Cte Matching Si
Density
Over 3.33G/Cm3
Standard Thickness
0.38mm, 0.5mm, 0.635mm, 1mm
Thickness Tolerance
±0.03 (Standard) / ±0.01 (Best)
Length and Width Tolerance
±2mm
Type
Ceramic Plates
Transport Package
Individual Package
Specification
Max. up to 140mm× 190mm
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular AlN Ceramic Substrate

Product Introduction

Aluminum nitride (AlN) is an advanced ceramic material for high power hybrid semiconductor packaging where high thermal conductivity is required. AlN ceramic substrates have a thermal conductivity of more than 170W/m·K.

Molding Technique of the Aluminum Nitride Ceramic Substrate

Although dry pressing and tape casting are suitable for producing high-performance aluminum nitride ceramic substrates, they are high in cost and low in production efficiency, and cannot meet the increasing demand for aluminum nitride ceramic substrates in the electronics industry. 

In order to solve this problem, in recent years, many manufacturers have adopted tape casting technique to produce aluminum nitride ceramic substrates. Tape casting has also become the main molding technique for aluminum nitride ceramic substrates used in the electronics industry.

0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate

Manufacturing Capacity

The aluminum nitride ceramic substrate has high hardness and high brittleness, making it difficult to process. Most of the aluminum nitride ceramic substrates are rectangular, square or round in shapes. Our rectangular shapes for as-fired aluminum nitride ceramic substrates are available up to 140mm×190mm.

Below is the standard dimensions of our bare AlN substrates.
 
AlN Ceramic Substrate
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As-fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
≥0.2   114.3 114.3   Tape Casting
0.38 140×190 140×190 120   Tape Casting
0.5 140×190 140×190 120   Tape Casting
0.635 140×190 200 200 Tape Casting
1 140×190 300 200 Tape Casting
1.5   300 200   Tape Casting
2   300 200   Tape Casting
2.5   300     Tape Casting
3   300     Tape Casting
  450     Isostatic Pressing
10   450     Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Product Parameters

For material properties, please refer to the table below.

AlN Ceramic Substrate
Item Unit Value
Mechanical Properties
Color / Gray
Density g/cm³ ≥3.33
Flexural Strength MPa ≥380
Water Absorption % 0
Camber Length‰ ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading) ºC >1000
CTE (Coefficient of
Thermal Expansion)
20-800ºC, 1×10-6/ºC 4-6
Thermal Conductivity 20ºC, W/m·K 170-230
Electrical Properties
Dielectric Constant 1MHz 8-10
Volume Resistivity 20ºC, Ω·cm ≥1013
Dielectric Strength KV/mm ≥17

Applications

0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate

FAQ

Q1: What is the Maximum Service Temperature of the Aluminum Nitride Ceramic Substrates?
Aluminum nitride ceramic substrates can withstand high temperature over 1000 ºC.

Q2: Do the Bare Ceramic Substrates Meet the Requirements for Metallized Ceramic Circuit Boards?
Yes. Metallized ceramic substrates, also known as metallized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates and other fields in the electronic industry due to their advantages of thinness, high temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.

Q3: What is the Maximum Thermal Conductivity of Your Bare Aluminum Nitride Substrates?
The thermal conductivity of aluminum nitride substrates is generally 170W/m·K or higher. The maximum value can reach 230W/m·K, which is 8 times that of alumina. It has broad development prospects in the fields like high-power electronic semiconductor modules, electronic heaters and semiconductor power hybrid circuits.

Q4: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect sample fee for MOQ.

Q5: How Long is the Production Lead Time?
If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.

If your question is not listed here, please contact us for more information.

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