Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Thickness: Customized
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
  • Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
  • Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
  • Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
  • Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
  • Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
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  • Overview
  • Product Introduction
  • Production Process
  • Our Advantages
  • Product Inspection
Overview

Basic Info.

Model NO.
Customized
Dielectric
Alumina Ceramic
Finished Product
Ceramic Circuit Board
Substrate Material
96%, 99.6% Alumina
Surface Metallization Process
Mo-Mn Metallization and Ni Plating
Feature
Excellent Electrical and Thermal Properties
Usage
to Realize Electrical Connections
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000

Packaging & Delivery

Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg

Product Description

Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board

Product Introduction

With the continuous development of power device technology,

especially with the rise of the third-generation semiconductor

technology, the application fields and demand of ceramic substrates

continue to expand due to their good thermal conductivity, heat

resistance, high strength and high reliability.
Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board
The metallization of the surface of the ceramic substrate is an

important prerequisite for determining its practical application, because

the metal is the component that is connected to the working circuit,

and the effective combination of the two improves the performance of

electronic products.

 

Production Process

There are many metallization methods on the surface of ceramic substrates and now we would like to introduce you to the Mo-Mn

method. In the field of ceramic substrate metallization, the most widely used method is the Mo-Mn (molybdenum-manganese) method. The main

advantages of the Mo-Mn method are:

1. The process is mature and stable;

2. High sealing strength, especially suitable for applications under harsh mechanical and climatic conditions;

3. It can be repaired many times without damaging the metallization layer;

4. The requirements for solder, metallization paste formula and sintering atmosphere are not very strict, and the process is easy to master.


The following is the general process of the Mo-Mn method applied to the surface of the ceramic substrate.

Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board

Our Advantages

Jinghui is a professional manufacturer of metallized ceramic substrates. It is our goal to provide ideal solutions for customers' different application

requirements. Whether it is cost or engineering solutions, our goal is to find the most economical and suitable solution for our customers!

Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board

Product Inspection

In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.

Mo-Mn Metallization Process Metallized 96% 99.6% Alumina Ceramic PCB Board

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