Laser Cutting Scribing Al2O3 Sheet Alumina Plate Blank Ceramic Substrate

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
• Material: Alumina Ceramic
• Model NO.: JJBP-0111-0008
• Forming Method: Tape Casting
• Features: High Mechanical Strength, Small Dielectric Loss
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Standard Thickness: 0.1-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Trial Order Supported
• Type: Ceramic Plates
• Transport Package: Individual Package
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Laser Cutting Scribing Al2O3 Sheet Alumina Plate Blank Ceramic Substrate

Product Introduction

Alumina ceramic is one of the most cost effective and widely used substrate materials in microelectronic applications. The substrates offer excellent electrical insulating properties, mechanical strength, good thermal conductivity, chemical durability and dimensional stability.

Material Properties Alumina Ceramic Substrates

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

Manufacturing Capacity

1. Our bare ceramic substrates are available in a wide variety of standard and custom thickness, shape, and size. 

(1) The standard thickness of the alumina ceramic substrate is 0.25mm, 0.30mm, 0.38mm, 0.50mm, 0.635mm, 0.76mm, 0.80mm, 0.89mm, 1.0mm, 1.5mm and 2.0mm. Minimum thickness to be 0.1mm. 

(2) Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm.

2. For products that require high dimensional accuracy, we can use various processing methods to process ceramic substrates, such as lapping, polishing, laser scribing, laser cutting, etc.
 

Laser Processing

(1) Hole Size
 

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Applications

Product Inspection

Packaging & Shipping

Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.