Power Devices Heatsink Insulation Pad for MOS Transistor IGBT Transistor

• Application: Refractory, Structure Ceramic, Industrial Ceramic, Insulation Ceramic
• Material: Alumina Ceramic
• Type: Ceramic Parts
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Standard
• Product Name: Alumina Ceramic Thermal Pad
• Grade of Material: 95% Alumina or Aluminum Nitride
• Color: White, Gray
• Feature: High Insulation, High Mechanical Strength
• About Pictures: for Reference Only
• About The Quotation: Please Contact Us for a Quote Based on Actual Prod
• Transport Package: Individual Packaging
• Specification: Max. 800mm mmx 1000mm x 30mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Production Capacity: 500000PCS/Month
• Package Size: 36.00cm * 20.00cm * 24.00cm
• Package Gross Weight: 8.000kg
• Lead Time: 3 days (1 - 5000 Pieces) ; To be negotiated ( > 5000 Pieces)

Product Description

Power Devices Heatsink Insulation Pad for MOS Transistor IGBT Transistor
 

Product Description

Ceramic pad for Mosfet TO packaging is made of 95% alumina (al2o3) which is an engineered ceramic.  It offers high thermal conducitivity up to 24 W/m.K. Therefore, the ceramic pad could quickly transfer the heat of IC generated to outside and ensure the chips reliability. 


The visual quality of alumina ceramic pad is vital at assemble process, Thus, deburr and polishing process will be manipulated before shipping, and then ensure the surface smooth free of any burrs. 


Besides, alumina ceramic pad in the application could offer other strengths, such as wonderful electrical insulation  high mechanical strength and corrosion resistance. The ceramic pad could significantly prolong the TO packaging service lifespan.

 

The specification

We have been producing various of standard alumina ceramic pads for MOS TO packaging, refer to the following table in detail:
 

S/N	Figure	Type	Size
1		For TO-220	20mm *14mm * 1mm with φ5mm hole
2		For TO-220	18.5mm * 12mm * 1mm with φ3.8mm hole
3		For TO-247	22mm * 17mm * 1mm with φ3.7mm hole
4		For TO-264	28mm * 22mm * 1mm with 3.4mm hole
5		For TO-3P	25mm * 20mm * 1mm with φ4mm hole

Remark:   0.6mm thick alumina ceramic pads are standard parts.
 

Typical Applications

These alumina ceramic pads are widely used in MOS/IC/triode, diode & IGBT,  high frequency communication devices, high density switching power supply, and high frenquency welding machines, and so on. 

Why choose us?

We have integrated production lines from raw material formulating, shaping, sintering and secondary process at house, hence, we could control the consistency of quality and manufacturing cost well. 

Certifications

Our Partners

If you are looking for ceramic pads for your Mosfet TO package,  please feel free to call us or email to us. We'll be there anytime.