| Customization: | Available |
|---|---|
| Application: | Structure Ceramic, Industrial Ceramic |
| Material: | Aluminum Nitride |
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Aluminum nitride ceramics have excellent electrical and thermal properties, and are considered to be the most promising high thermal conductivity
ceramic substrate materials. In order to seal the package structure, mount components and connect input and output terminals, the surface and
interior of the aluminum nitride ceramic substrate need to be metallized.
Why use Molybdenum-manganese Method?
In the field of ceramic substrate metallization, the most widely used method is the Mo-Mn (molybdenum-manganese) method. The main advantages
of the Mo-Mn method are:
1. The process is mature and stable;
2. High sealing strength, especially suitable for applications under harsh mechanical and climatic conditions;
3. It can be repaired many times without damaging the metallization layer;
4. The requirements for solder, metallization paste formula and sintering atmosphere are not very strict, and the process is easy to master.
The simple mechanism of molybdenum-manganese (Mo-Mn) ceramic metallization is: Mo powder and Mn powder are used as the main raw
materials, and the Mo layer is sintered at high temperature in a reducing atmosphere. Since the Mo layer is not easily wetted by solder, it is also
necessary to plate a layer of nickel on the metallized Mo layer.
In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.
Jinghui specializes in the production of metallized ceramic substrates, has rich experience in manufacturing ceramic circuit boards, and is proficient
in the surface treatment process of ceramic substrates such as Mo-Mn method (high-melting-point metal method), electroless nickel plating, silver
firing and Direct Bonded Copper (DBC).
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