| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Surface Metallization Process: | Electroless Nickel Plating Process |
| Feature: | Excellent Electrical and Thermal Properties |
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier What are the Advantages of Ceramic Substrates?
With the continuous development of power device technology, especially with the rise of the third-generation semiconductor technology, the
application fields and demand of ceramic substrates continue to expand due to their good thermal conductivity, heat resistance, high strength and
high reliability.
Why Metallization is Necessary on the Surface of Ceramic Substrates?
The metallization of the surface of the ceramic substrate is an important prerequisite for determining its practical application, because the metal is
the component that is connected to the working circuit, and the effective combination of the two improves the performance of electronic products.
What is Chemical Nickel Plating Method?
Chemical nickel plating, also known as electroless nickel plating or autocatalytic nickel plating, is to reduce the nickel ions in the plating solution to
metal and to deposit them onto the surface of the ceramic substrate with the help of a suitable reducing agent without an external current.
Suppliers with verified business licenses
Audited Supplier 
){kind=link}
){kind=link}