Laser Cutting High Thermal Conductivity AlN Sheet Aluminum Nitride Substrate
About Laser Cutting
Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.
Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.
With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.
As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
| AlN Ceramic Substrate |
| Thickness (mm) |
Maximum Size (mm) |
Shape |
Molding Technique |
| As-fired |
Lapped |
Polished |
Rectangular |
Square |
Round |
| 0.1-0.2 |
|
50.8 |
50.8 |
|
√ |
√ |
Tape Casting |
| ≥0.2 |
|
114.3 |
114.3 |
|
√ |
√ |
Tape Casting |
| 0.38 |
140×190 |
140×190 |
120 |
√ |
√ |
|
Tape Casting |
| 0.5 |
140×190 |
140×190 |
120 |
√ |
√ |
|
Tape Casting |
| 0.635 |
140×190 |
200 |
200 |
√ |
√ |
√ |
Tape Casting |
| 1 |
140×190 |
300 |
200 |
√ |
√ |
√ |
Tape Casting |
| 1.5 |
|
300 |
200 |
|
√ |
√ |
Tape Casting |
| 2 |
|
300 |
200 |
|
√ |
√ |
Tape Casting |
| 2.5 |
|
300 |
|
|
√ |
√ |
Tape Casting |
| 3 |
|
300 |
|
|
√ |
√ |
Tape Casting |
| … |
|
450 |
|
|
√ |
√ |
Isostatic Pressing |
| 10 |
|
450 |
|
|
√ |
√ |
Isostatic Pressing |
| Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. |
Laser Processing
(1) Hole Size
| AlN Ceramic Substrate |
| Hole Diameter (mm) |
Standard Tolerance (mm) |
| φ≤0.5 |
0.08 |
| φ>0.5 |
0.2 |
(2) Laser Scribing
| AlN Ceramic Substrate |
| Substrate Thickness (mm) |
the Percentage of
Laser Scribe Line Depth
to Thickness (%) |
| 0.2-0.3 |
40%±5% |
| 0.5<T≤1.0 |
50%±3% |
| 1.0<T≤1.2 |
55%±3% |
| 1.2<T≤1.5 |
60%±3% |
| 2.0 |
45% (Extreme Depth) |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. |
Specializing in the production of bare ceramic substrates, Jinghui Industry Ltd. has 10+ years of R&D experience. Our products have high cost performance and will definitely satisfy you.
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