Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate

Product Details
Customization: Available
Application: Industrial Ceramic
Material: Aluminium Nitride Ceramic
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
  • Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
  • Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
  • Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
  • Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
  • Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
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  • Overview
  • Product Introduction
  • Manufacturing Capacity
  • Product Parameters
  • Why Choose Us?
Overview

Basic Info.

Model NO.
JJBP-0141-0001
Features
High Thermal Conductivity, Cte Matching Si
Density
Over 3.33G/Cm3
Standard Thickness
0.1-3mm Available
Thickness Tolerance
±0.03/0.05mm (Depending on Thickness)
Length and Width Tolerance
±2mm
Type
Ceramic Plates
Transport Package
Cartons with EPE Foam
Specification
Max. up to 140mm× 190mm
Origin
China
HS Code
8547100000

Packaging & Delivery

Package Size
29.00cm * 17.00cm * 19.00cm
Package Gross Weight
0.500kg

Product Description

Laser Scribing AlN Ceramic Base PCB Heatsink Aluminium Nitride Substrate

Product Introduction

Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
About Laser Scribing

Due to the special properties of ceramic substrate materials, they generally cannot be processed by traditional processing techniques, and laser is an ideal tool for processing such materials.


Laser scribing has high precision, fast speed, no scratch on the workpiece and no mechanical deformation, and can process any graphics.

Manufacturing Capacity

The table below shows our standard thicknesses and sizes. If you have different needs, please feel free to contact us.
 

AlN Ceramic Substrate
 Thickness (mm)  Maximum Size (mm) Shape Molding Technique
As-fired Lapped Polished Rectangular Square Round
 0.1-0.2    50.8 50.8   Tape Casting
 ≥0.2    114.3 114.3   Tape Casting
 0.38  140×190 140×190 120   Tape Casting
 0.5  140×190 140×190 120   Tape Casting
 0.635  140×190 200 200 Tape Casting
 1  140×190 300 200 Tape Casting
 1.5    300 200   Tape Casting
 2    300 200   Tape Casting
 2.5    300     Tape Casting
 3    300     Tape Casting
     450     Isostatic Pressing
 10    450     Isostatic Pressing
 Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. 


Laser Processing

(1) Hole Size

AlN Ceramic Substrate
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.2

(2) Laser Scribing
 
AlN Ceramic Substrate
Substrate Thickness (mm) Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.5<T≤1.0 50%±3%
1.0<T≤1.2 55%±3%
1.2<T≤1.5 60%±3%
2.0 45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Product Parameters

AlN Ceramic Substrate
 Item   Unit   Value 
 Mechanical Properties 
 Color   /   Gray 
 Density   g/cm³   ≥3.33 
 Flexural Strength   MPa   ≥380 
 Water Absorption   %   0  
 Camber   Length‰   ≤3‰ 
 Thermal Properties 
 Max. Service Temperature (Non-loading)   ºC   >1000 
 CTE (Coefficient of
Thermal Expansion) 
 20-800ºC, 1×10-6/ºC   4-6 
Thermal Conductivity 20ºC, W/m·K 170-230
Electrical Properties
Dielectric Constant 1MHz 8-10
Volume Resistivity 20ºC, Ω·cm ≥1013
Dielectric Strength KV/mm ≥17

Why Choose Us?

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact us today with your specifications.

View More
 

Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
 

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