Laser Scribing AlN Ceramic Base PCB Heatsink Aluminium Nitride Substrate
About Laser Scribing
Due to the special properties of ceramic substrate materials, they generally cannot be processed by traditional processing techniques, and laser is an ideal tool for processing such materials.
Laser scribing has high precision, fast speed, no scratch on the workpiece and no mechanical deformation, and can process any graphics.
The table below shows our standard thicknesses and sizes. If you have different needs, please feel free to contact us.
AlN Ceramic Substrate |
Thickness (mm) |
Maximum Size (mm) |
Shape |
Molding Technique |
As-fired |
Lapped |
Polished |
Rectangular |
Square |
Round |
0.1-0.2 |
|
50.8 |
50.8 |
|
√ |
√ |
Tape Casting |
≥0.2 |
|
114.3 |
114.3 |
|
√ |
√ |
Tape Casting |
0.38 |
140×190 |
140×190 |
120 |
√ |
√ |
|
Tape Casting |
0.5 |
140×190 |
140×190 |
120 |
√ |
√ |
|
Tape Casting |
0.635 |
140×190 |
200 |
200 |
√ |
√ |
√ |
Tape Casting |
1 |
140×190 |
300 |
200 |
√ |
√ |
√ |
Tape Casting |
1.5 |
|
300 |
200 |
|
√ |
√ |
Tape Casting |
2 |
|
300 |
200 |
|
√ |
√ |
Tape Casting |
2.5 |
|
300 |
|
|
√ |
√ |
Tape Casting |
3 |
|
300 |
|
|
√ |
√ |
Tape Casting |
… |
|
450 |
|
|
√ |
√ |
Isostatic Pressing |
10 |
|
450 |
|
|
√ |
√ |
Isostatic Pressing |
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. |
Laser Processing
(1) Hole Size
AlN Ceramic Substrate |
Hole Diameter (mm) |
Standard Tolerance (mm) |
φ≤0.5 |
0.08 |
φ>0.5 |
0.2 |
(2) Laser Scribing
AlN Ceramic Substrate |
Substrate Thickness (mm) |
Laser Scribe Line Depth to Thickness (%) |
0.2-0.3 |
40%±5% |
0.5<T≤1.0 |
50%±3% |
1.0<T≤1.2 |
55%±3% |
1.2<T≤1.5 |
60%±3% |
2.0 |
45% (Extreme Depth) |
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. |
AlN Ceramic Substrate |
Item |
Unit |
Value |
Mechanical Properties |
Color |
/ |
Gray |
Density |
g/cm³ |
≥3.33 |
Flexural Strength |
MPa |
≥380 |
Water Absorption |
% |
0 |
Camber |
Length‰ |
≤3‰ |
Thermal Properties |
Max. Service Temperature (Non-loading) |
ºC |
>1000 |
CTE (Coefficient of
Thermal Expansion) |
20-800ºC, 1×10-6/ºC |
4-6 |
Thermal Conductivity |
20ºC, W/m·K |
170-230 |
Electrical Properties |
Dielectric Constant |
1MHz |
8-10 |
Volume Resistivity |
20ºC, Ω·cm |
≥1013 |
Dielectric Strength |
KV/mm |
≥17 |
The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact us today with your specifications.
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