Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate

• Application: Industrial Ceramic
• Type: Ceramic Plates
• Forming Method: Tape Casting
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: JJBP-0141-0001
• Features: High Thermal Conductivity, Cte Matching Si
• Density: Over 3.33G/Cm3
• Standard Thickness: 0.1-3mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Material: Aluminium Nitride Ceramic
• Transport Package: Cartons with EPE Foam
• Specification: Max. up to 140mm× 190mm
• Origin: China
• HS Code: 8547100000
• Package Size: 29.00cm * 17.00cm * 19.00cm
• Package Gross Weight: 0.500kg

Product Description

Laser Scribing AlN Ceramic Base PCB Heatsink Aluminium Nitride Substrate

Product Introduction

About Laser Scribing

Due to the special properties of ceramic substrate materials, they generally cannot be processed by traditional processing techniques, and laser is an ideal tool for processing such materials.


Laser scribing has high precision, fast speed, no scratch on the workpiece and no mechanical deformation, and can process any graphics.

Manufacturing Capacity

The table below shows our standard thicknesses and sizes. If you have different needs, please feel free to .
 

AlN Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As-fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Laser Processing

(1) Hole Size

AlN Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

AlN Ceramic Substrate
Substrate Thickness (mm)	Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.5<T≤1.0	50%±3%
1.0<T≤1.2	55%±3%
1.2<T≤1.5	60%±3%
2.0	45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Product Parameters

AlN Ceramic Substrate
Item	Unit	Value
Mechanical Properties
Color	/	Gray
Density	g/cm³	≥3.33
Flexural Strength	MPa	≥380
Water Absorption	%	0
Camber	Length‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	ºC	>1000
CTE (Coefficient of Thermal Expansion)	20-800ºC, 1×10^-6/ºC	4-6
Thermal Conductivity	20ºC, W/m·K	170-230
Electrical Properties
Dielectric Constant	1MHz	8-10
Volume Resistivity	20ºC, Ω·cm	≥10^13
Dielectric Strength	KV/mm	≥17

Why Choose Us?

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact us today with your specifications.