Ceramic Circuit Board Cutting Notching Micro Hole Laser Drilling Alumina Substrate

• Application: Electronics
• Type: Ceramic Plate
• Forming Method: Tape Casting
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Customized
• Material: 96% / 99.6% Alumina Ceramic
• Features: High Mechanical Strength, Small Dielectric Loss
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Standard Thickness: 0.25-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Trial Order
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Package Size: 19.00cm * 10.00cm * 12.00cm
• Package Gross Weight: 1.000kg

Product Description

Ceramic Circuit Board Cutting Notching Micro Hole Laser Drilling Alumina Substrate

Product Introduction

Alumina ceramic substrates have the main advantages of high temperature resistance, high electrical insulation performance, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to the components, but the ceramic material itself is hard and brittle.

The traditional drilling or punching method is not ideal for the drilling effect of ceramic substrates. It is often difficult to ensure the accuracy of the aperture and the smoothness of the hole wall, and often causes damage to the substrate. In order to solve this problem, laser drilling technology came into being and became the best choice for ceramic substrate processing.

Laser drilling technology is a non-contact processing method. The high-energy focusing of the laser beam instantly melts the material to form a small and precise hole with controllable aperture and high hole wall finish, thereby ensuring the integrity and functionality of the ceramic substrate.
 

 

Product Applications

 

Product Parameters

 

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

 

Manufacturing Capacity

1. Product Tolerances
 

Alumina Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<0.3	±0.03	±0.01
	0.30-1.0	±0.05	±0.01
	T>1.0	±10%	±0.01

2. Surface Roughness
 

Alumina Ceramic Substrate
Material	Surface Roughness (μm)
	As Fired	Lapped	Polished
96% Al2O3	Ra 0.2-0.75	Ra 0.3-0.7	Ra ≤0.05
99.6% Al2O3	Ra 0.05-0.15	Ra 0.1-0.5	Ra ≤0.05

FAQ

Q1: Can the Size be Customized?

Yes, most of the alumina ceramic substrates are rectangular, square or round in shapes. Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm. We offer customized products for special requirements.

Q2: What is the Maximum ServiceTemperature of the Alumina Ceramic Substrates?
Alumina ceramic substrates can withstand high temperature of 1200-1400 ºC.

Q3: What is the Minimum Thickness of the Alumina Ceramic Substrates?
Our standard thickness: 0.25mm, 0.30mm, 0.38mm, 0.50mm, 0.635mm, 0.76mm, 0.80mm, 0.89mm, 1.0mm, 1.5mm and 2.0mm. Minimum thickness to be 0.1mm. Welcome to inquire about customized services.

Q4: What is the Depth of the Laser Scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-65% of the substrate thickness. The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Q5: Can Alumina Ceramic Substrates be Polished?
Yes, lapping and polishing will provide the desired flatness and thickness tolerance, with a surface roughness generally below Ra0.05.

Q6: What is the Camber of the Alumina Ceramic Substrates?
Our alumina substrates are 100% inspected for camber. The camber is less than 5‰ for 96% alumina with a thickness below 0.3mm. For 96% alumina with other thicknesses and for other purities, the camber is less than 3‰.


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