Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating
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Product Highlights
- High Thermal Conductivity: Superior thermal diffusion compared to organic substrates like FR4, effectively reducing hot spot temperatures.
- Precise CTE Matching: Coefficient of thermal expansion matches chip materials like Si and GaAs to minimize thermal stress.
- Gold Plating Finish: Available in Golden Yellow finish with immersion nickel gold process for enhanced reliability.
- Double-Sided Design: Features double-sided metallization for versatile circuit applications in electronics and power supplies.
- 18+ Years Experience: Jinghui offers over 18 years of expertise in ceramic substrate production and DBC technology.
Product Attributes
- Customization
- Available
- Application
- Electronic Devices, Lighting, Power Supply, Semiconductors
- Material
- Al2O3
- Model NO.
- Customized
- Process
- Gold Plating
- Color
- Golden Yellow
- Layers
- Double-Sided
- Solder Mask
- None
- Finish
- Immersion Nickel Gold
- Transport Package
- Vacuum Packaging
- Specification
- As Required
- Trademark
- JingHui
- Origin
- China
- HS Code
- 8547100000
- Production Capacity
- 50000 PCS/Month
- Package Size
- 27.00cm * 17.00cm * 20.00cm
- Package Gross Weight
- 2.000kg
- Lead Time
-
35 days (1 - 100 Pieces)
To be negotiated ( > 100 Pieces)
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating
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Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating -
Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating -
Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating -
Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating -
Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating -
Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating -
Thick film Double-Sided Metallized Al2O3 Alumina Ceramic Substrate with Gold Plating
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Product Description
Structure and Composition
1. Ceramic Substrate:
Alumina (Al2O3): low cost, high mechanical strength, good dielectric properties (dielectric constant ~9.8), suitable for most conventional applications.
2. Metallization Layer:
A gold layer is formed on the ceramic surface by thick film printing (such as gold paste), thin film deposition (sputtering/plating) or direct bonding process, with a thickness of usually 0.1~10 μm.
Electrical Properties:
- Low resistance (the resistivity of gold is only 2.44 μΩ·cm), suitable for high-frequency signal transmission.
- High insulation (resistivity of ceramic body>1014Ω·cm), avoiding leakage.
Thermal Management:
- The thermal conductivity of ceramic substrate is much higher than that of organic substrate (such as FR4), and the rapid thermal diffusion of gold can effectively reduce the hot spot temperature.
Reliability:
- High temperature resistance (Al2O3 can withstand 1600ºC sintering), gold layer is anti-oxidation, and has good long-term stability.
- The coefficient of thermal expansion (CTE) matches the chip material (such as Si, GaAs) to reduce thermal stress.
Jinghui has more than 18 years of experience in ceramic substrate production. We can process precision circuits, especially good at DBC technology, silver firing technology, electroless nickel plating technology and Mo-Mn technology. You can consult us for more processing methods of ceramic substrates.
About the Supplier
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Company Profile
Established in 2008, JingHui Industry Ltd is a professional manufacturer and exporter that integrates the design, development, and production of various ceramic components in zirconia, alumina, silicon nitride, and aluminum nitride.
Our Facility is located in Loudi City, Hunan Province, and the export division is set up in Shenzhen city, with convenient transportation access. All of our products comply with international quality standards, such as ISO9001: 2015, RoHS, REACH, and FDA, and are greatly appreciated in various markets throughout the world.
We have over ten production lines covering raw material preparation, shaping, sintering, post-processing, metalizing and plating, and so on. The export business accounts for around 70% of our annual turnover. Our well-equipped facilities and excellent quality control system throughout all stages of production enable us to guarantee total customer satisfaction. Our high-quality products and outstanding customer service have helped us to build a global sales network in over 60 countries.
Our company offers a variety of technical ceramic products which can meet your multifarious demands. We have adhered to the management principles of "Quality First, Customer Orientation, and Credit-based" since the company's establishment and always do our best to satisfy every potential need of our customers. Our company is sincerely willing to cooperate with esteemed enterprises worldwide to realize a win-win situation since the trend of economic globalization has developed with irresistible force.
About Our Factory & Business Background
- Address
- 1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, Guangdong, China
- Terms of Payment
- LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, RMB
- International Commercial Terms(Incoterms)
- FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
- Average Lead Time
-
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays - Nearest Port
- Shenzhen, HongKong, Shanghai
Our Production Capability & Technical Expertise
Our Industry Experience & Global Business Record
- Export Year
- 2009-03-11
- Main Markets
- North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
FAQ
- What is the thermal conductivity of the substrate?
- The thermal conductivity is much higher than organic substrates like FR4, allowing rapid thermal diffusion to reduce hot spot temperatures.
- What materials are used for the metallization layer?
- A gold layer is formed using thick film printing, thin film deposition (sputtering/plating), or direct bonding processes.
- What is the lead time for orders?
- Peak season lead time is 1-3 months, while off-season lead time is within 15 workdays.
- What payment methods are accepted?
- Accepted payment methods include LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, and RMB.
- What is the dielectric constant of the alumina substrate?
- The dielectric constant is approximately 9.8, making it suitable for most conventional applications.
- Does the substrate match chip materials?
- Yes, the coefficient of thermal expansion (CTE) matches chip materials such as Si and GaAs to reduce thermal stress.
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