Alumina Thick Film IGBT Ceramic Substrate with Gold Plating

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Structure Ceramic, Industrial Ceramic, Brazing
Material: Alumina Ceramic
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Manufacturer/Factory, Trading Company, Group Corporation

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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
  • Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
  • Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
  • Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
  • Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
  • Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
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  • Overview
  • Product Description
  • Typical Applications
  • We also produce
  • FAQ
Overview

Basic Info.

Model NO.
Customized
Product Name
IGBT Ceramic Substrate
Optional Purity
96%, 99% Alumina
Color
White, Beige
Norminal
1% of Dimensions
Usage
for Ceramic to Metal Joint Technology
Type
Ceramic Parts
Transport Package
Vacuum Packaging with Desciant
Specification
36cm x 20cm x 24cm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000/Month

Product Description

Product Description

Alumina Thick Film IGBT Ceramic Substrate with Gold Plating

The description of the IGBT ceramic substrate
Ceramic Substrate is a frequently used as electronic packaging material, widely used in the packaging of the hybrid integrated circuit and multichip module. The prime characteristics of ceramic substrates include1
1. High thermal conductivity
2. Similar CTE as the material of chip Si and AsGa
3. High bonding/brazing strength with chip
4. Low dielectric constant and dielectric loss
5. Excellent corrosion resistance
6. High mechanical strength with 300~400MPa
7. Good electrical insulation

Our company has been specializing in making metallized alumina ceramic substrates and aluminum oxide ceramic substrates for ages. The main manufacturing process include DBC, DPC, Mo/Mn covering with Ag plating and so on. The thickness of metal plating and the pattern of the circuit can be customized. 

Typical Applications

Alumina Thick Film IGBT Ceramic Substrate with Gold Plating


We also produce

We also produce a variety of ALN ceramic wafer, ALN CoB substrate with DBC, DPC, AMB metallizing process.

Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
Alumina Thick Film IGBT Ceramic Substrate with Gold Plating

FAQ

Q1. Are you a factory or trading company?

A: We are a manufacturer with 15 years of OEM, ODM experience for technical ceramic components. 

Q2: Do you send a sample to check?
A: For sure, the standard type of sample in stock would be free of charge, but freight collect.

Q3: When can I get the price?
A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of getting the price.
Please call us or tell us in your email so that we will proceed with your inquiry as a priority.

Q4: Is it available to provide customized products?
A: We always support custom-made demand as per different materials, dimensions, and designs.

Q5: How to ensure quality?
A: The dimension out of any batch will be carried out sampling inspection per international AQL standard.
The cosmetic inspection will be done fully.

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