Alumina Thick Film IGBT Ceramic Substrate with Gold Plating
The description of the IGBT ceramic substrate
Ceramic Substrate is a frequently used as electronic packaging material, widely used in the packaging of the hybrid integrated circuit and multichip module. The prime characteristics of ceramic substrates include1
1. High thermal conductivity
2. Similar CTE as the material of chip Si and AsGa
3. High bonding/brazing strength with chip
4. Low dielectric constant and dielectric loss
5. Excellent corrosion resistance
6. High mechanical strength with 300~400MPa
7. Good electrical insulation
Our company has been specializing in making metallized alumina ceramic substrates and aluminum oxide ceramic substrates for ages. The main manufacturing process include DBC, DPC, Mo/Mn covering with Ag plating and so on. The thickness of metal plating and the pattern of the circuit can be customized.
We also produce a variety of ALN ceramic wafer, ALN CoB substrate with DBC, DPC, AMB metallizing process.
Q1. Are you a factory or trading company?
A: We are a manufacturer with 15 years of OEM, ODM experience for technical ceramic components.
Q2: Do you send a sample to check?
A: For sure, the standard type of sample in stock would be free of charge, but freight collect.
Q3: When can I get the price?
A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of getting the price.
Please call us or tell us in your email so that we will proceed with your inquiry as a priority.
Q4: Is it available to provide customized products?
A: We always support custom-made demand as per different materials, dimensions, and designs.
Q5: How to ensure quality?
A: The dimension out of any batch will be carried out sampling inspection per international AQL standard.
The cosmetic inspection will be done fully.
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