High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating

Product Details
Customization: Available
Application: Refractory, Structure Ceramic, Industrial Ceramic, Brazing
Material: Alumina Ceramic
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
  • High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
  • High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
  • High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
  • High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
  • High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
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  • Overview
  • Product Description
  • We also produce
  • Typical Applications
  • Why choose us?
Overview

Basic Info.

Model NO.
Customized and standard optional
Product Name
Mo/Mn Metallized Ceramic Substrate
Optional Purity
96%, 99% and 99.5% Alumina
Color
White, Beige, Pink
Surface Treatment
Polished, Glazed
Norminal
1% of Dimensions
Usage
for Ceramic to Metal Joint Technology
Type
Ceramic Parts
Transport Package
Vacuum Packaging with Desciant
Specification
36cm x 20cm x 24cm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000/Month

Product Description

High Purity Alumina Mo/Mn Metallized Ceramic Substrate With Ag Plating

Product Description

The description of the metalized ceramic substrate

Ceramic substrate metallization is to firmly adhere a layer of metal film on the surface of ceramic substrate to realize the welding between ceramic and metal. There are many ceramic substrate metallization processes such as Mo-Mn method, electroless nickel plating method, silver firing method, and Direct Bonded Copper (DBC) method.

The Mo-Mn method is also called the high-melting-point metal method. It is based on the refractory metal powder Mo, and then mixes with a small amount of low-melting-point Mn to the metallization formula, adds a binder to coat the ceramic surface, and then sinters to form a metallization layer.
This method is mainly used in the metallization of Al2O3. If this method is to be used on the surface of AlN, a layer of Al2O3 needs to be pre-oxidized The following is a schematic diagram of the Mo-Mn Method of the ceramic substrate surface metallization process.

Refer to the following manufacturing chart flow for Mo/Mn metallizing process


High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating

We also produce

High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating

Remark:
Besides Mo/Mn metallizing process, we also deal with DBC, TFC and TPC process per customers' different requirements.

Typical Applications

High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating

Why choose us?

High Purity Alumina Mo/Mn Metallized Ceramic Substrate with AG Plating
We will do all above inspection by internal before shipping.

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