| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Structure Ceramic, Industrial Ceramic, Brazing |
| Material: | Alumina Ceramic |
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Our facility have been using a selection of metallized manufacturing process with high-volume production, including Mo/Mn method, DBC ( direct bonded copper), DPC (direct plated copper).
The ceramic body of metallized substrates are commonly made from high purity aluminum oxide and aluminum nitride, they are features with high thermal conductivity, similar coefficient of thermal expansion as silicon chips with very low mechnical stress. These outstanding characteristics significantly improve the lifetime.
Under the trend of intelligence, the application of DPC technology will be more common to meet the needs of miniaturization and high precision.
Jinghui's mature DPC technology can customize the thickness of metal circuits for you to meet your diverse needs.
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