Laser Cutting Any Graphics Processing Bare Al2O3 Alumina Ceramic Substrate

• Application: Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
• Material: Alumina Ceramic
• Type: Ceramic Plates
• Forming Method: Tape Casting
• Features: High Mechanical Strength, Small Dielectric Loss
• Optional Color: White, Ivory, Pink, Black
• Model NO.: JJBP-0111-0008
• Density: Over 3.70g/cm3
• Standard Thickness: 0.25-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Laser Cutting Any Graphics Processing Bare Al2O3 Alumina Ceramic Substrate

Product Introduction

 

About Laser Cutting

Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.

Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture. With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.

As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.

 

Why Choose Us?

Jinghui Industry Ltd. is dedicated to producing high quality products. We do our best to ensure that any substrates supplied by Jinghui Industry Ltd. fully meet your performance expectations. In order to meet this goal, we provide pre-sales and after-sales services including design guidance, proofing, production, delivery, follow up on the goods quality, etc.

Manufacturing Capacity

1. Our bare ceramic substrates are available in a wide variety of standard and custom thickness, shape, and size.

2. For products that require high dimensional accuracy, we can use various processing methods to process ceramic substrates, such as lapping, polishing, laser scribing, laser cutting, etc.

Laser Processing

(1) Hole Size

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing

Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

Product Inspection

FAQ

Q1: What is the Minimum Thickness of the Alumina Ceramic Substrates?
Our standard thickness: 0.25mm, 0.30mm, 0.38mm, 0.50mm, 0.635mm, 0.76mm, 0.80mm, 0.89mm, 1.0mm, 1.5mm and 2.0mm. Minimum thickness to be 0.1mm. Welcome to inquire about customized services.

Q2: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect sample fee for MOQ.

Q3: How Long is the Production Lead Time?
If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.

Q4: How are Ceramic Substrates Packaged to Avoid Breakage?
Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.

Q5: Can Alumina Ceramic Substrates be Polished?
Yes, lapping and polishing will provide the desired flatness and thickness tolerance, with a surface roughness generally below Ra0.05.

Q6: What is the Camber of the Alumina Ceramic Substrates?
Our alumina substrates are 100% inspected for camber. The camber is less than 5‰ for 96% alumina with a thickness below 0.3mm. For 96% alumina with other thicknesses and for other purities, the camber is less than 3‰.

If your question is not listed here, please contact us for more information.