Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
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Product Details
| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | AlN |
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1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, ...
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Basic Info.
- Model NO.
- JJBP-0141-0021
- Forming Method
- Tape Casting
- Feature
- High Thermal Conductivity, Cte Matching Si
- Density
- Over 3.33G/Cm3
- Standard Thickness
- 0.38-3mm
- Customized Service
- OEM, ODM, Prototyping, Mass Production
- Transport Package
- Individual Packaging
- Trademark
- Jinghui
- Origin
- China
- HS Code
- 6914100000
- Production Capacity
- 50000 Pieces/Month
Packaging & Delivery
- Package Size
- 27.00cm * 17.00cm * 20.00cm
- Package Gross Weight
- 2.000kg
Product Description
Laser Cutting Scribing Aluminum Nitride Substrate AlN Ceramic Heatsink
(2) Laser Scribing
About Laser Cutting
Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.
Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.
With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.
As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.
Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.
With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.
As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
We can make various specifications. The table below shows our standard sizes.
| AlN Ceramic Heatsink | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Forming Method | ||||
| As-fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| ≥0.2 | 114.3 | 114.3 | √ | √ | Tape Casting | ||
| 0.38 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.5 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.635 | 140×190 | 200 | 200 | √ | √ | √ | Tape Casting |
| 1 | 140×190 | 300 | 200 | √ | √ | √ | Tape Casting |
| 1.5 | 300 | 200 | √ | √ | Tape Casting | ||
| 2 | 300 | 200 | √ | √ | Tape Casting | ||
| 2.5 | 300 | √ | √ | Tape Casting | |||
| 3 | 300 | √ | √ | Tape Casting | |||
| … | 450 | √ | √ | Isostatic Pressing | |||
| 10 | 450 | √ | √ | Isostatic Pressing | |||
| Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. | |||||||
Laser Processing
(1) Hole Size
| AlN Ceramic Heatsink | |
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.2 |
(2) Laser Scribing
| AlN Ceramic Heatsink | |
| Substrate Thickness (mm) | the Percentage of Laser Scribe Line Depth to Thickness (%) |
| 0.2-0.3 | 40%±5% |
| 0.5<T≤1.0 | 50%±3% |
| 1.0<T≤1.2 | 55%±3% |
| 1.2<T≤1.5 | 60%±3% |
| 2.0 | 45% (Extreme Depth) |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. | |
We have been making ceramic substrates for more than 15 years. We can meet your various customized requirements, and our products have high dimensional accuracy and excellent performance. Please feel free to contact us.
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