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Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink

SHENZHEN JINGHUI INDUSTRY LIMITED
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Product Images of Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink

Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink pictures & photos
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink pictures & photos
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink pictures & photos
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink pictures & photos
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink pictures & photos
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink pictures & photos
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
  • Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
  • Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
    Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
  • Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
    Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
  • Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
    Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
  • Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
    Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
  • Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
    Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
  • Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink
    Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink

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Product Description

Laser Cutting Scribing Aluminum Nitride Substrate AlN Ceramic Heatsink

Product Introduction

About Laser Cutting

Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.

Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.

With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.

As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink

Product Specifications

We can make various specifications. The table below shows our standard sizes.
 

AlN Ceramic Heatsink
Thickness (mm) Maximum Size (mm) Shape Forming Method
As-fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   √ √ Tape Casting
≥0.2   114.3 114.3   √ √ Tape Casting
0.38 140×190 140×190 120 √ √   Tape Casting
0.5 140×190 140×190 120 √ √   Tape Casting
0.635 140×190 200 200 √ √ √ Tape Casting
1 140×190 300 200 √ √ √ Tape Casting
1.5   300 200   √ √ Tape Casting
2   300 200   √ √ Tape Casting
2.5   300     √ √ Tape Casting
3   300     √ √ Tape Casting
…   450     √ √ Isostatic Pressing
10   450     √ √ Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Manufacturing Capacity

Laser Processing

(1) Hole Size

 
AlN Ceramic Heatsink
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.2

(2) Laser Scribing
 
AlN Ceramic Heatsink
Substrate Thickness (mm) the Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.5<T≤1.0 50%±3%
1.0<T≤1.2 55%±3%
1.2<T≤1.5 60%±3%
2.0 45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Why Choose Us?

We have been making ceramic substrates for more than 15 years. We can meet your various customized requirements, and our products have high dimensional accuracy and excellent performance. Please feel free to contact us.


Laser Cutting Scribing Aluminum Nitride Substrate Aln Ceramic Heatsink

About the Supplier

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SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED

About Our Factory & Business Background

Address
1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, Guangdong, China
Terms of Payment
LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, RMB
International Commercial Terms(Incoterms)
FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Average Lead Time
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Nearest Port
Shenzhen, HongKong, Shanghai

Our Production Capability & Technical Expertise

Main Products
Metallized Ceramics, Ceramic Substrates, Pepper Mill Mechanism, Pepper Grinder Mechanism, Ceramic Parts, Precision Ceramics, Zirconia Ceramics, Ceramic Insulators, Silicon Nitride Ceramics, Aluminum Nitride Ceamics

Our Industry Experience & Global Business Record

Export Year
2009-03-11
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

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