0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Blank Ceramic Circuit Board
Standard: GB, ISO 9001
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • 0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
  • 0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
  • 0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
  • 0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
  • 0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
  • 0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
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  • Overview
  • Product Introduction
  • Product Inspection
  • Packaging & Shipping
  • Product Parameters
  • Why Choose Us?
Overview

Basic Info.

Model NO.
JJBP-0111-0018
Type
Ceramic Substrate
Forming Method
Tape Casting
Purity of Material
96%, 99.6% Alumina
Features
High Mechanical Strength, Small Dielectric Loss
Optional Color
White, Ivory, Pink, Black
Density
Over 3.70g/cm3
Standard Thickness
0.1-0.635mm Available
Thickness Tolerance
±0.03 (Standard) / ±0.01 (Best)
Length and Width Tolerance
±2mm
Customized Service
OEM, ODM, Prototyping, Trial Order Supported
Transport Package
Individual Package
Specification
Max. up to 114.3mm x 114.3mm
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer


0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
 

Product Introduction

About the Thickness

The thicker the alumina ceramic substrate, the better the strength and the stronger the pressure resistance, but the thermal conductivity is worse than that of the thinner one.

On the contrary, the thinner the substrate, the weaker the strength and pressure resistance than the thicker one, but the thermal conductivity is stronger.


Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
0.25   114.3 114.3     Tape Casting
0.38 120 114.3 114.3     Tape Casting
0.5 120 114.3 114.3     Tape Casting
0.635 120 114.3 114.3     Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.25 120 114.3 114.3     Tape Casting
0.3 120 114.3 114.3     Tape Casting
0.38 140×190         Tape Casting
0.5 140×190         Tape Casting
0.635 140×190         Tape Casting
0.76 130×140         Tape Casting
0.8 130×140         Tape Casting
0.89 130×140         Tape Casting
1 280×240         Tape Casting
1.5 165×210         Tape Casting
2 500×500         Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.
 

Product Inspection

0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
 

Packaging & Shipping

0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer
 

Product Parameters

Alumina Ceramic Substrate
Item Unit 96% Al2O3 99.6% Al2O3
Mechanical Properties
Color / / White Ivory
Density Drainage Method g/cm3 3.70 3.95
Light Reflectivity 400nm/1mm % 94 83
Flexural Strength Three Point Bending MPa >350 >500
Fracture Toughness Indentation Method MPa·m1/2 3.0 3.0
Vickers Hardness Load 4.9N GPa 14 16
Young's Modulus Stretching Method GPa 340 300
Water Absorption    % 0 0
Camber / Length‰ T≤0.3: 5, Others: ≤3‰ ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading) / ºC 1200 1400
CTE (Coefficient of
Thermal Expansion)
20-800ºC 1×10-6/ºC 7.8 7.9
Thermal Conductivity 25ºC W/m·K >24 >29
Thermal Shock Resistance 800ºC 10 Times No Crack No Crack
Specific Heat 25ºC J/kg·k 750 780
Electrical Properties
Dielectric Constant 25ºC, 1MHz / 9.4 9.8
Dielectric Loss Angle 25ºC, 1MHz ×10-4 3 2
Volume Resistivity 25ºC Ω·cm 1014 1014
Dielectric Strength DC KV/mm 15 15

Why Choose Us?

Jinghui Industry Ltd. is dedicated to producing high quality products. We do our best to ensure that any substrates supplied by Jinghui Industry Ltd. fully meet your performance expectations. In order to meet this goal, we provide pre-sales and after-sales services including design guidance, proofing, production, delivery, follow up on the goods quality, etc.

0.1mm to 0.635mm Lapped Polished Al2O3 Alumina Ceramic Wafer

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